MediaTek · HsinChu
Technological Sourcing Manager - Packaging (2.5D/3.5D/Panel)
Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
Apply on MediaTek’s careers site →Job description
- Responsible for technology and supply ecosystem planning in Data Center ASIC Packaging (2.5D/3.5D/Panel) domains.
- Develop deep understanding of suppliers' technology capabilities, capacity planning, and roadmap direction to build strategic ecosystem insights.
- Engage with R&D early during product definition and design phases to incorporate supply chain and manufacturing perspectives.
- Ensure product design are aligned with future supplier technology readiness, capacity, and manufacturing capability during design phases.
- Proactively identify technology and supply risks to enable scalable and competitive product solutions during design phases. #LI-JK1
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