MediaTek · HsinChu
Advanced Packaging Principal Engineer (EMIB/2.5D/3D)
Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
Apply on MediaTek’s careers site →Job description
1. 2.5D/3.5D package technology development 2. SoC/Memory heterogeneous integration package development 3. Package technology integration, NPI and MP 4. Project management
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