Datacenter Compute Platform Architect
Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
Apply on MediaTek’s careers site →Job description
MediaTek’s Data Center team is at the forefront of innovation, driving the development of cutting-edge technologies that power the world's most advanced data centers. We are a dynamic group of system architects, packaging technology developers, and SoC design experts dedicated to creating high-performance, efficient, and reliable solutions. Our team collaborates closely to push the boundaries of technology, ensuring optimal performance, power efficiency, and scalability for data center applications.
Join our Data Center team and be a part of the technological revolution that is shaping the future of data centers. If you are passionate about innovation and have the expertise to drive strategic technology development, we would love to hear from you.
Role Summary
We are looking for a visionary Datacenter Compute Platform Architect to enable our cutting-edge silicon on the platform. While our SoC architects focus on what goes inside the chip, you will be the owner of the system that surrounds it. In this role, you will define the end-to-end server platform architecture, ensuring our CPUs operate at peak performance, efficiency, and reliability within cloud infrastructure. You will drive hardware specifications spanning power delivery, thermal management, memory topologies, high-speed I/O routing, and system management.
You will work closely with internal silicon teams, firmware engineers, and external OEM/ODM partners and hyperscale customers to bring next-generation compute platforms from concept to mass deployment.
Platform Architecture Definition
- Define the compute system architecture (workstation, 1U/2U, multi-node, OCP form factors) surrounding our Datacenter compute SoC.
Power & Thermal Management
- Architect system-level power delivery networks (PDN/VRM specs) and collaborate on advanced thermal solutions (air and liquid cooling) to meet strict datacenter TDP constraints.
High-Speed I/O & Memory
- Define system-level topologies and routing guidelines for high-speed interfaces, including LP/DDR5/6, PCIe Gen 5/6, and CXL. Ensure Signal Integrity (SI) and Power Integrity (PI) targets are met at the board level.
Server Management & Security
- Define architectures for Baseboard Management Controllers (BMC), OpenBMC integration, hardware Root of Trust (RoT), and system-level security (e.g., SPDM, TPMs).
Firmware/OS Co-Design
- Partner with SoC silicon, BIOS/UEFI, OS, and firmware teams to define ACPI tables, RAS (Reliability, Availability, and Serviceability) flows, and power management states.
Ecosystem & Partner Enablement
- Act as the primary technical interface for Tier-1 ODMs, OEMs, and Cloud Service Providers (CSPs) to ensure successful platform design, validation, and deployment.
Location
open to San Jose, San Diego, Portland and Austin #LI-WC2
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