MediaTek · HsinChu
Memory Packaging Technical Manager
Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
Apply on MediaTek’s careers site →Job description
Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM development #LI-JK1
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