MediaTek · HsinChu
Package and Chip thermal/stress simulation engineer
Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
Apply on MediaTek’s careers site →Job description
- Package related structure stress analysis including warpage, material study.
- Package and board level stress modeling for TCT, drop and vibration.
- IC and package thermal analysis, modeling and characterization
- Chip-Package-PCB thermal co-simulation and design.
- System level thermal simulation
- System level stress simulation #LI-JK1
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