RFIC Packaging (Mechanical) Engineer

Job description

RFIC Package Development Job Description

Technical lead for RFIC package development, supporting NPI from concept through production release. This individual will provide direction to product and design engineers for optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages and metal packages for RF and Microwave IC’s.

We are looking for an individual who has a proven track record of managing multiple product development programs in parallel and reducing to practice on schedule in a high volume manufacturing environment.

Responsibilities

Technical lead for RF/microwave plastic, ceramic and metal packages

• Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
• Work with vendors and internal engineering resources to establish and update design rules for packaging
• Establish and implement robust assembly processes internally and at our contract manufacturers Troubleshoot IC packaging defects, then define and implement solutions
• Provide supplier benchmarking and tracking data to drive backend technology roadmap Working with Quality organization, characterize failure modes, and analyze as a function of packaging materials and processes
• Provide thermal modeling and application notes for new packages