Process Engineer 4

Job description

Responsible for performing professional process engineering research, development, and evaluation in support of the company's complex semiconductor capital equipment and systems. Reviews processing techniques and methods applied in the manufacture, fabrication and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. May conceive and plan projects involving definition and selection of new concepts and approaches in the processing or development of new processes.

Supports customer technology managers in the planning, data collection, analysis, and reporting of customer demos to defend existing process applications. Works with customer and senior engineers cross functionally to understand roadmaps, process flow, inflection points, requirements and business issues/ challenges. Utilize simulation tools like Sem3D (MAPD) & AI/ML based tools to drive process development strategies in optimizing the etch processes.

Analyze data and provide insights to improve process performance, yield and efficiency. Utilize JMP and other tools to generate process sensitivities and trade-offs Work closely with C&F (concept & feasibility) teams to drive and adopt new process innovations and technology roadmaps. Great presentation skills to clearly articulate demo status, complex etch strategies Works with customer to demonstrate and introduce new technologies at customer sites through demos, on site evaluations, and new tool qualifications.

Drives the adoption of new technology at the customer site. Acts as single point of contact accountable for process, hardware, software, etc. related requests from customer and work with cross-functional teams within BU in the planning, data collection, analysis, and reporting of customer demos to defend existing process applications. Master's degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field with 8+ years of experience; or a PhD with 5+ years' experience; or equivalent experience.

Leadership In-depth understanding and working knowledge of Semiconductor processes such as Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD) Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), Capacitively Coupled Plasma (CCP). Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques.

Experience in surface preparation and analytical techniques. Interest in advanced technology and an on-going desire to learn.

In-depth understanding and working knowledge of Statistical

• Process Control (SPC) and/or
• Design of Experiments (DOE); experience with statistical tools (JMP, Minitab, etc.)
• Strong organizational skills and demonstrated ability to manage multiple tasks simultaneously and ability to react to shifting priorities to meet business needs and deadlines.

Excellent people skills with demonstrated ability to work effectively and efficiently with diverse teams, semiconductor customers, internal and external partners.