Device Engineer

Job description

Job Details

Job Description: Intel Ireland Device Engineering team (Yield department) is looking for Device Engineering talents (reporting to manger of Device team) to join our advanced technology Fab. As a Device Engineer/Senior Device Engineer, you will focus on most advanced FinFETs technology device engineering/development working closely with Integration, Module, yield teams to achieve yield ramp-up, process and device optimization in the high-volume manufacturing Fab, supporting internal and external customers.

Device engineers' responsibilities include (but are not limited to): Drive factory product Power and Performance roadmap and member/leader of the Performance TMI team to ensure the factory products hit customer specifications required, including device targeting, customization, variability improvement etc. Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets. Work with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs.

Participate or lead cross-organizational team of engineers to identify root cause of device-related yield/performance issues and define mitigation plan to meet committed production yield/performance targets. Own NPI (New Product Introduction) in production fab and perform device-related process optimizations to meet foundry customers product specifications and requirements. Develop a model to predict device performance accurately in early-to-mid stage of Si progression and drive systematic solution to maintain baseline device performance.

Work with Process Integration engineers to drive process simplification and implement cost reduction engineering opportunities in line. Level of experience will be considered in determining applicants job grade.

Qualifications

Candidate should possess the following behavioral skills:

Skills

Required: Problem Solving: Demonstrated experience in rapidly analyzing complex process problems and identifying effective solution paths.

Teamwork and Partnership

Strong teamwork skills and the ability to build effective partnerships.

Communication

Excellent written and verbal communication skills, with the ability to summarize and communicate information effectively to influence action at all levels.

Self-Motivation

A motivated self-starter with the ability to work independently as well as collaboratively in a team environment.

Flexibility

Maturity and adaptability in facing uncertainties and changing priorities or responsibilities.

Goal Commitment

Commitment to achieving aggressive goals with a positive, can-do attitude and ability to act with velocity and a strong sense of urgency.

Qualifications

Minimum Qualifications: Relevant Bachelors, Masters and/or a PhD degree in Device physics, Electronics, physics chemistry or related technical field. 5-10 years' experience in advanced node semiconductor industry in Device or FEOL/BEOL Integration. 5-10 years' experience in FinFET technology development or high-volume manufacturing. 5-10 years' experience with Device Physics and hands-on application in real-world fab environment.

Preferred Qualifications

Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major. Experience driving product performance roadmaps working in multi discipline team with Process Engineers, Integration Engineers and Yield Analysis to deliver reliable, cost effective and stable/capable products. Experience working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance.

Demonstrated interpersonal skills including influencing, engaging, and motivating. Experience in serving external Foundry customers through technical interactions. Experience in GAA (Gate-All-Around) technology architecture. Experience in new semiconductor technology development. Basic understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.

Job Type

Experienced Hire Shift: Shift 1 (Ireland)

Primary Location

Ireland, Leixlip Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A EU Salary We offer a total compensation package that ranks among the best in the industry. Annual Salary Range for this job which could be performed in Ireland is: €71,300.00 - €133,900.00 The compensation range displayed in this posting reflects the minimum and maximum target compensation for this position. Within this range, individual pay is determined by job related skills, experience, and relevant education, training.

As part of our total compensation approach, the final offer may include additional pay components and benefits. Your recruiting team will share the confirmed base salary along with any applicable total compensation elements upon employment offer delivery. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. *