Principal Engineer Cross Platform Technology Integration

Job description

In this role, you will harmonize Technology Integration activities across multiple platforms, driving synergy through the implementation of best practices and the sharing of technical expertise. You will provide Technology Integration leadership for cross-platform technology projects, ensuring alignment, effective collaboration, and successful execution of key development objectives.

• Act as a TI lead for new technology involving more than one platforms Responsible in PBC and TPC assessment Owner of Risk Interaction assessment and mitigation work packages Integration ownership of Pre-development for new Chip technology that involved multiple platforms Harmonize the Integration of unit processes (BOM and Process) and new chip technology involving different package platforms Working partner for FE in FE/BE interaction and integration topics
• Act as a driver/team member for 8D/problem-solving for interaction issues
• Drive synergy, best practice implementation and sharing of lesson learnt across platforms
• Provide technical guidance/assistance when needed in the projects related to interaction topic You strive to leverage your strong expertise in semiconductor packaging, assembly, testing, and technology interactions to drive effective collaboration, problem-solving, and technical integration across diverse stakeholders and platforms.

You demonstrate proficiency in structured methodologies such as 8D, DFMEA/PFMEA, DOE, and reliability analysis to identify risks, optimize processes, and deliver robust engineering solutions. Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) At least 10 years of working experience in IC/semiconductor environment Strong Semiconductor Packaging, Assembly and Test knowledge Good aptitude for communication, collaboration, negotiation, and solution finding Experience in FE/BE and BE/BE Interactions Possess knowledge of 8D & T6s methodology Possess knowledge of DFMEA/PFMEA Experience in Internal Package analysis/ first level reliability Possess knowledge of DOE & Comparative methods We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process.

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