Senior Hardware Design Engineer, High Speed Networking

Job description

Who You’ll Work With Working closely with cross-functional teams including software, product management, marketing, and manufacturing, our engineers innovate new system architectures and develop high-speed PCBs requiring state-of the-art signal integrity and power integrity design practices.

What You'll Do

Our Hardware Design Engineering team is at the forefront of developing high-speed networking and Ethernet products used in Enterprise campuses, hyperscale datacenters and bleeding edge AI clusters. The team is responsible for the end-to-end design and development of advanced hardware solutions that meet the demands of modern networking environments. Candidates for this position would be responsible for the entire hardware design process: Authoring functional specifications of high power and high density

Ethernet switches used in AI networks Selecting and qualifying components Schematic capture and tool-based design verification Working closely with eCAD teams on PCB layout and component footprints Working with internal teams to run (or run your own) signal integrity simulations on both power and datapath signals Working closely with mechanical and thermal engineers on the system general arrangement and physical realization

Specifying PCB stackup and fabrication details with various PCB vendors Working with internal teams to develop (or develop your own) programmable logic devices for control and timing planes Working closely with local and overseas Contract Manufacturers (CM), from proto through production Lab bring up and debug of prototypes Working closely with diagnostics software engineers on both design validation and manufacturing test development

Driving complex system debug between software, hardware, and test teams Training CM for high yield test and manufacturing Guiding groups of engineers and mentoring younger engineers

Qualifications

BSEE or MSEE 10+ years of relevant experience in hardware engineering Experience designing networking hardware, particularly involving 100G and 200G PAM4 Ethernet switching Embedded x86/ARM system design is highly desirable Experience designing 20+ layer count boards featuring 50G+ signals, and advanced PCB manufacturing technologies such as sequential lamination, HDI, and ultra-low-loss materials Experience working with multi-phase DC/DC’s for high current, high transient loads Experience working with high speed interfaces, such as DDR, PCIe Writing specifications and drawing schematics for high complexity boards Working closely with CAD designers on complicated layout and routing Working closely with Software and test engineers to bring-up and debug systems

• Familiarity with signal integrity and power integrity concepts and tools, such as: impedance, PDN’s, differential routing, insertion loss, S-parameters, TDR’s, VNA’s Experience with mass production
• Design for Manufacturability (DFM) FPGA design and system simulation using Verilog and or VHDL Working with Contract manufacturers Successfully taking products from concept to production #LI-AC1