Advanced Interconnect Lead, Quantum AI

Job description

Minimum qualifications

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience. 6 years of experience working with technology and process Research and Development (R&D) in Micro-electromechanical systems (MEMS), Printed Circuit Board (PCB), or silicon technologies. 3 years of experience in technical leadership.

Preferred qualifications

Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). Experience with a scripting or a programming language. Experience with materials and integration technologies for electronics in extreme environments. Microwave engineering experience. About the job As a Quantum Hardware Engineer for Advanced Interconnect Lead, you will manage the advanced interconnect team to solve our integration and interconnect issues.

You will be responsible for realizing new technologies for integration of cryogenic microwave devices and superconducting quantum processors. You will collaborate with other researchers and engineers on the Quantum AI team, and external academic and industrial partners, to develop the integration technologies to be used in our next-generation of quantum computers. You will also seek out and develop partnerships with vendors and other entities to advance our knowledge and capabilities to meet our quantum roadmap milestones.

You will use your experience in silicon, PCB, and MEMS technologies to manage multiple projects simultaneously. You will bring curiosity and engineering intuition to develop the understanding needed to improve superconducting quantum hardware system performance, and precision to pave the way for rapidly increasing the number of qubits in accordance with our roadmap.