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Xiaomi · 北京

# 硬件研发工程师-结构/工艺方向

北京 

Listed on Xiaomi ’s official careers site. Posted August 11, 2026. Check that it is still open and apply there.
[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/campus/position/7671129153600751913/detail)

[OpenNash Jobs](https://jobs.opennash.com/) / [Xiaomi ](https://jobs.opennash.com/companies/xiaomi/) / 硬件研发工程师-结构/工艺方向

## Job description

1 负责相机模组、马达 结构的设计和配合项目整机的堆叠工作 2 负责模组结构在模组厂 整机厂的可靠性 失效问题处理解决 3 负责模组结构设计标准的梳理和规范制定 工艺开发以及制程评估 4 负责竞品的竞对分析 新材料 新工艺的验证导入

## Qualifications

1. 电子信息工程等电子工程类专业,精密仪器、自动化、机械设计等相关专业优先； 2.了解成像电子元器件工作原理、结构设计、图像处理类优先； 3.可熟练使用C、matlab、python、AutoCAD、ANSYS等工具； 4.具备较强的学习能力与执行力,良好的沟通和协作能力。

## At a glance
- Posted by the employer: Aug 11, 2026
- First seen by OpenNash: Oct 19, 2026
- Last checked: Oct 19, 2026
- Listed for: 69 days
- Location: 北京[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/campus/position/7671129153600751913/detail)

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