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Xiaomi · 上海 / 北京

# 芯片封装技术开发工程师&专家

上海 / 北京 

Listed on Xiaomi ’s official careers site. Posted December 12, 2024. Check that it is still open and apply there.
[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/index/position/7345417766566314093/detail)

[OpenNash Jobs](https://jobs.opennash.com/) / [Xiaomi ](https://jobs.opennash.com/companies/xiaomi/) / 芯片封装技术开发工程师&专家

## Job description
- 先进工艺节点芯片产品的FO、2.5D、3D、Chiplet等封装技术调研、封装方案制定；
- 先进封装技术项目规划与实施，根据IPD流程按照计划推动和执行项目任务，定位和解决项目中的封装相关技术问题，达成项目目标；
- 基于封装设计方案，带领封装设计、封装工程、SI/PI、应力和散热分析各个领域人员，迭代和优化封装方案，输出设计指导规范；
- 新技术、新材料验证与导入；
- 先进封装技术洞察分析，支撑芯片的竞争力持续提升。

## Qualifications
- 有先进封装技术开发和导入经验；
- 熟悉和了解FCCSP，WLCSP，FCBGA，SiP，POP，FanOut，2.5D/3D等封装类型的工艺流程和设计要点；
- 了解Cadence Allegro等封装Layout工具；
- 本科及以上学历，半导体封装/材料/微电子/力学等相关专业。

## At a glance
- Posted by the employer: Dec 12, 2024
- First seen by OpenNash: Aug 1, 2026
- Last checked: Oct 19, 2026
- Listed for: Over a year
- Location: 上海 / 北京[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/index/position/7345417766566314093/detail)

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OpenNash lists jobs from employers’ own careers sites and does not handle applications.
Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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