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Xiaomi · 北京

# 顶尖应届-软硬协同优化研究员-软件

北京 

Listed on Xiaomi ’s official careers site. Posted June 3, 2026. Check that it is still open and apply there.
[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/toptalent/position/7646710168231004457/detail)

[OpenNash Jobs](https://jobs.opennash.com/) / [Xiaomi ](https://jobs.opennash.com/companies/xiaomi/) / 顶尖应届-软硬协同优化研究员-软件

## Job description
- 主导手机端侧AI模型的性能优化与能效突破，助力端侧高效的AI推理；
- 从算法、编译器、推理引擎、算子到芯片特性，进行全栈式软硬协同优化；
- 跟踪业界最佳成果，挖掘优化方向，协同论证可行性，优化落地效果；
- 整合米端软件到芯片能力，基于AI模型的特性与瓶颈，推动SoC芯片的定制开发；
- 探索构建GPU/NPU/CPU异构并行方案，拓展端侧AI推理的优化路径；
- 对移动端硬件做深度分析，建立benchmark模型，辅助端侧模型的能效优化。

## Qualifications

### 模型
- 深度理解MoE、Transformer、LLM推理原理，及端侧推理优化技术；

### 系统
- 熟悉异构计算、推理引擎、内存/IO布局；

### 经验
- 有移动端侧模型部署、调优经验者优化；

### MoE
- 有MoE模型工程优化经验者优化。

## At a glance
- Posted by the employer: Jun 3, 2026
- First seen by OpenNash: Aug 1, 2026
- Last checked: Oct 19, 2026
- Listed for: 138 days
- Location: 北京[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/toptalent/position/7646710168231004457/detail)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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