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Xiaomi · 北京

# 顶尖实习-大模型芯片协同设计研究员-MiMo

北京 

Listed on Xiaomi ’s official careers site. Posted June 9, 2026. Check that it is still open and apply there.
[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/topintern/position/7559917059506358579/detail)

[OpenNash Jobs](https://jobs.opennash.com/) / [Xiaomi ](https://jobs.opennash.com/companies/xiaomi/) / 顶尖实习-大模型芯片协同设计研究员-MiMo

## Job description

当模型规模触顶硬件天花板，真正的突破来自从模型到芯片的协同设计（Co-design）——让模型结构天然适配硬件特性，让芯片架构为模型量身定制。这正是我们在做的事。你将深入 MiMo 大模型的核心，从模型架构到推理效率，再到与自研芯片团队的深度协作，打通从算法到硅片的全链路。 你会做什么？

### 模型架构设计
- 参与大模型核心架构的探索与迭代，设计兼顾建模能力与计算效率的架构（如高效 Attention 等）；

### 模型高效推理
- 研究低比特量化、稀疏化、投机解码等技术，在精度与推理效率之间找到最优解；

### 端到端性能优化
- 从算子、内存访问模式到系统级调度，推动软硬件协同的极致性能；

### 芯片协同设计
- 基于对芯片计算特性（数据流、存储层次、互联带宽）的理解，将模型侧的洞察转化为芯片架构的设计指引，与自研芯片团队紧密合作。

## Qualifications

### 我们希望你是这样的人
- 对大模型架构有扎实理解；
- 熟悉推理优化技术栈（量化/稀疏/投机解码/高效算子等）；
- 对芯片/计算机体系结构有真实兴趣 。

### 加分项
- 有大模型训练/微调经验；
- 有 CUDA/Triton kernel 开发经验；
- 在系统、体系结构或 ML 方向的顶会有论文发表。

## At a glance
- Posted by the employer: Jun 9, 2026
- First seen by OpenNash: Aug 1, 2026
- Last checked: Oct 19, 2026
- Listed for: 132 days
- Location: 北京[Apply on Xiaomi ’s careers site →](https://xiaomi.jobs.f.mioffice.cn/topintern/position/7559917059506358579/detail)

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