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Texas Instruments · Chengdu, Sichuan, China

# 芯片贴装设备工程师/Die Attach Equipment Engineer

Chengdu, Sichuan, China Operations 

Listed on Texas Instruments’s official careers site. Posted July 16, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016588)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / 芯片贴装设备工程师/Die Attach Equipment Engineer

## Job description

### 岗位职责
- 负责Die Attach 固晶产线全套生产设备日常运维、故障维修、预防性保养、备件管理；
- 负责制定设备采购规格书，安装调试、量产参数校准、设备技改升级、产线设备稼动率管控；
- 处理产线突发设备停机故障，输出设备故障分析报告，降低设备宕机损耗；
- 编制设备保养手册、设备点检标准；管控设备耗材、备品备件库存；
- 对接设备原厂完成设备维修、版本升级、硬件改造工作。

## Qualifications

### 学历
- 全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；

### 工作经验
- 3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；

### 技能基础
- 熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；

### 综合素质
- 逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项 ： 熟悉ASM、Besi等主流固晶机结构与运维逻辑优先。

## At a glance
- Posted by the employer: Jul 16, 2026
- First seen by OpenNash: Aug 21, 2026
- Last checked: Oct 18, 2026
- Listed for: 94 days
- Location: Chengdu, Sichuan, China[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016588)

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