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Texas Instruments · Japan

# Packaging Engineer - HV GaN module

Japan Full-time Operations 

Listed on Texas Instruments’s official careers site. Posted October 25, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25019129)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / Packaging Engineer - HV GaN module

## Job description

The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for HV GaN module development engineer Responsibilities: Design, develop, and characterize high voltage (200–1200V) packages and high-power modules targeting AI infrastructure and Industrial market Understand market trends and end equipment system requirements and translate these into package design specifications. Define packaging solutions across HV technologies including GaN, SiC, IGBT, and Isolation Technologies; validate designs using CAD, thermomechanical, and electrical parasitic extraction tools.

Work with material suppliers (mold compounds, die attach, substrates) to qualify materials meeting HV application requirements. Collaborate with cross-functional teams across sites to support development and ramp of new products.

## Qualifications

### Minimum Qualifications

MS degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field. 5+ years of hands-on experience in high voltage (200V–1200V) or high-power semiconductor packaging across GaN, SiC, IGBT technologies. Hands-on experience with HV package and power module design, materials, and assembly flow integration (molded packages such as TOLT, TOLG, Q-DPAK, DIP, SIP and case modules). Familiarity with HV Bill of Materials including mold compounds, die attach, and DBC substrates.

Experience with stress, thermal, and electrical parasitic modeling tools. Understanding of HV discrete and power module reliability and qualification requirements; ability to support qualification activities and contribute to problem solving. Good communication skills; able to work effectively with internal teams and external suppliers. Proficiency in English and Japanese. Prior experience supporting scale-up of HV packages or modules from prototype to volume manufacturing.

Experience in presenting technical work at internal reviews or industry conferences Working knowledge of clip attach, flip chip packaging, and wafer bumping processes.

Preferred Qualifications

## At a glance
- Posted by the employer: Oct 25, 2026
- First seen by OpenNash: Nov 1, 2026
- Last checked: Nov 1, 2026
- Listed for: 7 days
- Location: Japan
- Employment type: Full-time[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25019129)

## Hiring at Texas Instruments
- Open jobs: 869
- New in the last 7 days: After two weekly collections
- Tracked since: Jul 10, 2026

[All Texas Instruments jobs](https://jobs.opennash.com/companies/texas-instruments/) · [Weekly hiring report](/reports/hiring/)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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