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Texas Instruments · Melaka, Malaysia

# Senior Wirebond Equipment Engineer

Melaka, Malaysia On-site Senior individual contributor Operations 

Listed on Texas Instruments’s official careers site. Posted October 15, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25008987)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / Senior Wirebond Equipment Engineer

## Job description

Change the world. Love your job. Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments Wire Bond Equipment Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment.

Responsibilities include: Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment Keeping current on equipment manufacturers' technical notices, upgrades and safety issues Studying equipment performance and reliability Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process Providing technical support to the manufacturing equipment repair and process engineering organizations Defining and writing preventative maintenance schedules

## Qualifications

### Minimum Requirements

Bachelor Degree of Electronics or Electrical engineering, Mechanical Engineering or related engineering degree Minimum 5 years as Wirebond Equipment Engineer with KNS and ASM wirebond equipment maintenance experience in semiconductor manufacturing operations Equipped with Wirebond process experiences will be added advantage Work Arrangement: Full-time, onsite role based at Texas Instruments Malaysia, Batu Berendam, Malacca.

### Preferred Qualifications

Equipment experience with Wire bond process, must be able to hands on KNS and ASM wire bond machine Prior experience with Gold/Cu/PCC wire & Bump ball process bonding Equipment experience on other equipment post wire bond process (e.g., plasma, Die coat) Experience on tool monitoring and interdiction software, and equipment maintenance and documentation Working knowledge of semiconductor manufacturing, and SPC/Spotfire techniques.

Experienced with semiconductor cleanroom protocol and behaviors.
- Strong verbal and written communication skills
- Demonstrated strong analytical, critical thinking and problem solving skills
- Ability to work in teams and collaborate effectively with people in different functions
- Ability to take the initiative and drive for results
- Strong time management skills that enable on-time project delivery
- Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
- Demonstrated ability to build strong, influential relationships

## At a glance
- Posted by the employer: Oct 15, 2026
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 7 days
- Location: Melaka, Malaysia
- Work arrangement: On-site[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25008987)

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