[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Texas Instruments jobs](https://jobs.opennash.com/companies/texas-instruments/) · [Search jobs](/search/) Texas Instruments · Lehi, UT # Wet Process Development Engineer Lehi, UT, United States Operations Listed on Texas Instruments’s official careers site. Posted June 2, 2026. Check that it is still open and apply there. [Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25009610) [OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / Wet Process Development Engineer ## Job description Change the world. Love your job. SiGe strained channel and silicided contact integration at 28nm demands wet etch and clean chemistries that operate at nanometer precision: removing exactly the right material, at exactly the right selectivity, without disturbing adjacent films or device structures. At LFAB, these processes don’t yet exist in production form. You will build them. As a Wet Process Development Engineer in TI’s ATD organization in Lehi, you will own the development, integration, and qualification of wet etch and clean modules for the 28nm SiGe and silicidation device flows which which directly enabling LFAB’s technology ramp from development to high-volume manufacturing. Your work spans the full arc from chemistry formulation through module integration, yield analysis, and production readiness. The wet process modules you develop will run on every wafer at LFAB. Responsibilities include: Module Integration: Develop and optimize wet process flows for SiGe epi-layer cleaning and selective removal without damage to underlying Si or gate oxide Selective Etching: Define chemistries for high-precision isotropic and anisotropic etching with focus on SiGe/Si/silicided film selectivity and undercut control at 28nm geometries Yield & Defectivity: Identify root causes of process-related defects using FMEA and 8D methodologies; implement Statistical Process Control (SPC) to support the 28nm yield ramp toward high-volume manufacturing Cross-Functional Collaboration: Partner with Epi, Lithography, Spacer Films, and CMP teams to ensure seamless integration of wet modules into the full 28nm SiGe and silicidation fabrication flow Metrology & Characterization: Utilize SEM, TEM, ellipsometry, and AFM to characterize surface roughness and etch profiles at atomic resolution This role requires the ability to manage multiple parallel workstreams under schedule pressure, lead technical discussions with authority, communicate status and risks clearly, and drive alignment across organizational boundaries in a fast-paced technology development environment. ## Qualifications ### Minimum requirements Master’s or Ph.D. in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field 5+ years in R&D semiconductor wafer fabrication for advanced nodes (28nm or below) Technical depth in: SiGe device physics, surface preparation, and chemical reaction kinetics Wet etch chemistries across a broad range of film types Hands-on experience with single-wafer or batch wet process tools (LAM, TEL, SCREEN, or equivalent) - Design of Experiments (DOE) methodology Leading cross-functional teams from concept to production-ready status Preferred qualifications: Experience developing new wet process modules from the ground up - Strong inline-to-end-of-line signal correlation and process characterization skills - Ability to build and maintain stakeholder relationships across internal and external partners - Strong verbal and written communication skills - Demonstrated ability to ramp quickly on new systems and processes ## At a glance - Posted by the employer: Jun 2, 2026 - First seen by OpenNash: Jul 10, 2026 - Last checked: Oct 18, 2026 - Listed for: 138 days - Location: Lehi, UT, United States[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25009610) ## More jobs at Texas Instruments ### [ALD Thin Film Process Development Engineer](https://jobs.opennash.com/companies/texas-instruments/jobs/af5c35196f80396c739b/) Lehi, UT, United States ### [Career Accelerator Program - Process Development Engineer - MS/PhD - Lehi](https://jobs.opennash.com/companies/texas-instruments/jobs/4d693009d9b524e348cf/) Lehi, UT, United States ### [Device and Process Integration Engineer](https://jobs.opennash.com/companies/texas-instruments/jobs/1139c0e6296e2976a482/) Lehi, UT, United States ### [Device/Process Integration Engineer](https://jobs.opennash.com/companies/texas-instruments/jobs/48cd3c79d3e666fe6f58/) Lehi, UT, United States ## Similar jobs at other companies ### [Principal/MTS Wet Process Development Engineer, DRAM Wet Process (Evergreen)](https://jobs.opennash.com/companies/micron-technology/jobs/5f71f1822330f9df77ca/) Micron Technology · Boise, ID - Main Site ### [Engineer-Wet Process Equipment Development](https://jobs.opennash.com/companies/micron-technology/jobs/89deadabbed26d978d66/) Micron Technology · Boise, ID - Main Site ### [Wet Clean Process Development Engineer](https://jobs.opennash.com/companies/samsung-electronics/jobs/2cac279672aa9f03b063/) Samsung Electronics · Austin, TX, USA ### [R&D Process Engineer - Wafer Wet Process Engineer](https://jobs.opennash.com/companies/keysight-technologies/jobs/35139d84b54cbff82c2e/) Keysight Technologies · Santa Rosa, California ### [Senior Equipment Engineer, Wet Chemical Process, Raxium](https://jobs.opennash.com/companies/alphabet/jobs/af4899d00553c3f1f43c/) Alphabet · Fremont, CA, USA OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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