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Texas Instruments

# Test & Plating Process Engineer (MES Project)

Wilayah Persekutuan Kuala Lumpur, Malaysia Manufacturing & Production 

Listed on Texas Instruments’s official careers site. Posted October 7, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25018269)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / Test & Plating Process Engineer (MES Project)

## Job description

Change the world. Love your job. Texas Instruments is seeking a Process Engineer to lead the digital design of our Test & Plating manufacturing processes.

### This is a unique, multi-phase role

following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

### Key Responsibilities

MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.

### Control & Exception Handling

Design the digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition.

### Alignment & Validation

Align requirements between manufacturing and quality teams. Validate proposed digital workflows and support UAT and deployment.

### Sustaining (Post-Project Phase)

Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework.

## Qualifications

### Minimum requirements
- Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
- Strong hands-on semiconductor process experience in Test & Plating, with minimum
- 2 years of relevant experience
- Strong foundation in statistical process control, engineering change control and process release strategies Preferred qualifications: Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early Experience in optimizing process parameters for wedge bonding or die attach accuracy.
- Demonstrated strong analytical and problem solving skills
- Strong verbal and written communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Demonstrated ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for result

## At a glance
- Posted by the employer: Oct 7, 2026
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 11 days
- Location: Wilayah Persekutuan Kuala Lumpur, Malaysia[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25018269)

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