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Texas Instruments · Chengdu, Sichuan, China

# 引线框架结构设计师/Lead Frame Designer

Chengdu, Sichuan, China Manager or lead Design 

Listed on Texas Instruments’s official careers site. Posted July 16, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016591)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / 引线框架结构设计师/Lead Frame Designer

## Job description

### 岗位职责
- 负责半导体封装引线框架（Lead Frame），substrate，结构设计、版图绘制、规格定义；
- 根据芯片封装需求、电性参数、散热需求完成框架结构、引脚布局、封装外形设计；
- 输出框架设计图纸、BOM清单、生产加工规格书，对接加工厂完成样品打样；
- 跟进框架样品验证、量产适配性测试，解决封装端框架匹配不良问题；
- 结合封装工艺优化框架结构，适配固晶、焊线、塑封全工序生产需求；跟进行业新型引线框架结 构迭代。

## Qualifications

### 学历
- 全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；

### 工作经验
- 3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；

### 技能基础
- 熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；

### 综合素质
- 逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟练使用AutoCAD、Altium Designer等设计软件；熟悉半导体铜框架、镀银框架生产工艺优先。

## At a glance
- Posted by the employer: Jul 16, 2026
- First seen by OpenNash: Aug 21, 2026
- Last checked: Oct 18, 2026
- Listed for: 94 days
- Location: Chengdu, Sichuan, China[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016591)

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