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Texas Instruments · Chengdu, Sichuan, China

# 芯片贴装工艺工程师/Die Attach Process Engineer

Chengdu, Sichuan, China Manufacturing & Production 

Listed on Texas Instruments’s official careers site. Posted July 16, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016585)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / 芯片贴装工艺工程师/Die Attach Process Engineer

## Job description

### 岗位职责
- 负责半导体封装Die Attach（固晶/芯片贴装）工序量产工艺管控、参数调试与制程优化；
- 主导固晶工序良率提升、制程异常分析、不良根因定位及闭环改善；
- 编制、修订固晶工序工艺规范、作业指导书（SOP）、 FMEA、制程管控文件；
- 负责新产品NPI导入、物料适配验证、固晶胶/芯片基材工艺适配测试；
- 对接设备、品质、生产部门，解决量产端固晶偏移、虚焊、掉晶、气泡等工艺类不良问题。

## Qualifications

### 学历
- 全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；

### 工作经验
- 3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；

### 技能基础
- 熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；

### 综合素质
- 逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉主流固晶设备工艺逻辑；有功率器件/车载芯片,固晶工艺经验, SMT贴片讲演，flip chip经验优先。

## At a glance
- Posted by the employer: Jul 16, 2026
- First seen by OpenNash: Aug 21, 2026
- Last checked: Oct 18, 2026
- Listed for: 94 days
- Location: Chengdu, Sichuan, China[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016585)

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