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Texas Instruments · Chengdu, Sichuan, China

# 塑封工艺工程师/Molding Process Engineer

Chengdu, Sichuan, China Manufacturing & Production 

Listed on Texas Instruments’s official careers site. Posted July 16, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016587)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / 塑封工艺工程师/Molding Process Engineer

## Job description

### 岗位职责
- 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护；
- 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良；
- 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控；
- 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升；
- 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。

## Qualifications

### 学历
- 全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；

### 工作经验
- 3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；

### 技能基础
- 熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；

### 综合素质
- 逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉车载芯片塑封工艺、抗潮耐温塑封制程经验优先。

## At a glance
- Posted by the employer: Jul 16, 2026
- First seen by OpenNash: Aug 21, 2026
- Last checked: Oct 18, 2026
- Listed for: 94 days
- Location: Chengdu, Sichuan, China[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016587)

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