[Skip to main content](#main-content) [ OpenNash ](https://opennash.com/) / [Jobs](https://jobs.opennash.com/) [ 01 Search jobs](https://jobs.opennash.com/search/)[ 02 Companies](https://jobs.opennash.com/explore/)[ 03 Hiring report](https://jobs.opennash.com/reports/hiring/)[ 04 AI assistants](https://jobs.opennash.com/connect/)[ 05 How it works](https://jobs.opennash.com/methodology/) Texas Instruments · Japan # Packaging Engineer - Inductor and Power module Japan Full-time Operations Listed on Texas Instruments’s official careers site. Posted October 25, 2026. Check that it is still open and apply there. [Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25019130) [OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / Packaging Engineer - Inductor and Power module ## Job description The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for Inductor and Power module development engineer Responsibilities: Design and develop ultra-compact, high-density, high current (100–300A) power delivery modules targeting enterprise and AI infrastructure applications. Understand market trends and end equipment system requirements and translate these into package design specifications. Work with magnetic material and component suppliers to evaluate and qualify materials, inductors, and capacitors that meet performance, reliability, and scaling requirements. Ensure manufacturability, testability, and reliability through evaluation, material qualification, and supplier collaboration. Collaborate with cross-functional teams across sites to support development schedules and time-to-market targets. ## Qualifications ### Minimum Qualifications MS degree in Electrical Engineering, Materials Science, or related field with focus on magnetics and power packaging. 5+ years of hands-on experience in inductor design or package development. Working knowledge of power delivery architectures, thermal management, EMI, and reliability constraints. Good understanding of magnetic material types. Familiarity with material characterization techniques (BH analyzer, VSM, SEM, EDX). Understanding of material processing for ceramic, metal powder, and composite materials. ### Familiarity with inductor coil forming and termination processes wire wound, multilayer, metal composite, thin film, etc. Good communication skills; able to work effectively with internal teams and external suppliers. Proficiency in English and Japanese. ### Preferred Qualifications Hands-on experience with simulation tools such as Maxwell, Ansys, or Femtet; familiarity with homogenization, model order reduction, and optimization techniques (NN, AI/ML a plus). Prior contributions to patents or publications in magnetics, packaging, or passive integration. Familiarity with magnetic supplier capabilities and emerging research directions. ## At a glance - Posted by the employer: Oct 25, 2026 - First seen by OpenNash: Nov 1, 2026 - Last checked: Nov 1, 2026 - Listed for: 7 days - Location: Japan - Employment type: Full-time[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25019130) ## Hiring at Texas Instruments - Open jobs: 869 - New in the last 7 days: After two weekly collections - Tracked since: Jul 10, 2026 [All Texas Instruments jobs](https://jobs.opennash.com/companies/texas-instruments/) · [Weekly hiring report](/reports/hiring/) ## More jobs at Texas Instruments ### [2028 Field Applications Engineering Intern](https://jobs.opennash.com/companies/texas-instruments/jobs/f89657f1e245fe7c77c3/) Japan ### [Career Accelerator Program - Operations Analyst](https://jobs.opennash.com/companies/texas-instruments/jobs/faf43ec0a79f47f1862c/) Japan ### [Equipment Engineer](https://jobs.opennash.com/companies/texas-instruments/jobs/3daf951c2801c1bb1346/) Japan ## Similar jobs at other companies ### [Senior Power Packaging Engineer](https://jobs.opennash.com/companies/monolithic-power-systems/jobs/8e0093722e0261ad3820/) Monolithic Power Systems · Shanghai - China ### [Engineer, Packaging Engineering](https://jobs.opennash.com/companies/sandisk/jobs/ede917ca8fd0fe48d75c/) Sandisk ### [Senior Packaging Engineer](https://jobs.opennash.com/companies/sandisk/jobs/6f2c2469fad38de10b49/) Sandisk ### [Mechanical Engineer – Power Electronics Packaging, RIVR](https://jobs.opennash.com/companies/amazon/jobs/2855bfad70058d97f594/) Amazon · CH, Zurich ### [Senior Packaging Engineer](https://jobs.opennash.com/companies/microsoft/jobs/6e243837e33c4a8e2eb5/) Microsoft · Malaysia, Pulau Pinang, Gelugor OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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