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Texas Instruments · Chengdu, Sichuan, China

# 焊线工艺&设备工程师/Wire Bond Process and Equipment Engineer

Chengdu, Sichuan, China Operations 

Listed on Texas Instruments’s official careers site. Posted July 16, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016586)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / 焊线工艺&设备工程师/Wire Bond Process and Equipment Engineer

## Job description

### 岗位职责
- 兼顾Wire Bond（引线键合）工序工艺管控+设备运维全模块工作；
- 负责金线/铝线/铜线焊线制程参数优化、量产良率管控、打火不良、断线、拉力不达标等工艺异常整改；
- 负责焊线机台日常保养、故障维修、设备校准、机台稼动率提升；
- 完成焊线工序新产品导入、工艺验证、工艺文件编制；
- 统筹焊线工序工艺和设备类问题闭环，推进产线标准化落地。

## Qualifications

### 学历
- 全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；

### 工作经验
- 3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；

### 技能基础
- 熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；

### 综合素质
- 逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 具备键合拉力、球剪测试实操经验；熟悉半导体引线键合行业标准优先。

## At a glance
- Posted by the employer: Jul 16, 2026
- First seen by OpenNash: Aug 21, 2026
- Last checked: Oct 18, 2026
- Listed for: 94 days
- Location: Chengdu, Sichuan, China[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016586)

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