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Texas Instruments · Chengdu, Sichuan, China

# 塑封设备工程师/Molding Equipment Engineer

Chengdu, Sichuan, China Operations 

Listed on Texas Instruments’s official careers site. Posted July 16, 2026. Check that it is still open and apply there.
[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016589)

[OpenNash Jobs](https://jobs.opennash.com/) / [Texas Instruments](https://jobs.opennash.com/companies/texas-instruments/) / 塑封设备工程师/Molding Equipment Engineer

## Job description

### 岗位职责
- 负责Molding 塑封压机、自动塑封产线设备日常运维、故障抢修、周期性保养；
- 负责制定塑封设备采购规格书，模具调试、硬件检修、设备技改、产线自动化改造；
- 统计设备OEE数据，制定设备改善方案，提升产线整体设备稼动率；
- 管理塑封产线设备备件、模具台账，对接供应商完成模具维修与设备升级；
- 配合工艺工程师完成塑封工序设备参数调试与新产品试产工作。

## Qualifications

### 学历
- 全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先；

### 工作经验
- 3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑；

### 技能基础
- 熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作；

### 综合素质
- 逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件；

## At a glance
- Posted by the employer: Jul 16, 2026
- First seen by OpenNash: Aug 21, 2026
- Last checked: Oct 18, 2026
- Listed for: 94 days
- Location: Chengdu, Sichuan, China[Apply on Texas Instruments’s careers site →](https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/job/25016589)

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