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TE Connectivity · Taiwan

# MGR II R&D/Product DVL Engineering(SI ICC)

Taiwan Research & Science 

Listed on TE Connectivity’s official careers site. Listed as of November 3, 2026. Check that it is still open and apply there.
[Apply on TE Connectivity’s careers site →](https://careers.te.com/job/TAIPEI-MGR-II-R&DPRODUCT-DVL-ENGINEERING%28SI-ICC%29-TPQ-11070/1446666500/)

[OpenNash Jobs](https://jobs.opennash.com/) / [TE Connectivity](https://jobs.opennash.com/companies/te-connectivity/) / MGR II R&D/Product DVL Engineering(SI ICC)

## Job description

### Job Overview

As a member of the Digital Data Networks (DDN) business in TE Connectivity you will play a key role in the design of products for high-speed products in the connector, cable assembly, and/or radio system industry—targeting high-speed communications and connectivity within datacenters and wireless infrastructure. As a manager of Product Development Engineering in Signal Integrity (SI), you will lead a team of SI engineers in all aspects of electrical design, simulation, and verification-validation testing.

You will be responsible for leading your team to successfully achieve business objectives in a dynamic business environment while fostering a culture of high performance, innovation, and employee wellbeing.

### Job Requirements
- Manage and lead a team of regional/global signal integrity engineers in establishing signal integrity design performance and functional requirements for new products
- Lead the team to perform signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface.
- Guide the team in connector and cable assembly design and qualifications from a signal integrity standpoint with a focus on making data driven decisions about the product functionality and areas for improvement.
- Create actionable recommendations based upon design reviews and simulation results.
- Lead the team in communicating actions and impacts clearly to stakeholders including management, customers, and the technical community.
- Align the technology roadmap with the market trends, customer needs, and implement accordingly.
- Drive a culture of innovation using a base of traditional approaches and external knowledge to develop innovative solutions.
- Effectively lead a regional/global team of SI engineers of varying levels of experience with different backgrounds, experiences, and cultures.
- Drive high performance by providing your team routine coaching and feedback, holding your team accountable to meet performance objectives, and providing meaningful development to increase individual/team capability.
- Manage employee wellbeing by prioritizing work, effectively managing resource loading, and providing flexibility to enable employees to successfully balance their work and personal lives. What your background should look like
- Bachelor’s degree in Electrical Engineering or equivalent work experience; Master's Degree preferred
- Generally requires 7 years of relevant work experience in electrical Design, RF design or PCB design
- Generally requires a minimum of 2 years of progressive leadership and people management experience in a regional environment
- A solid understanding of electromagnetic theory and electrical circuit behavior
- Expert with Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools)
- Proficient with 3D CAD tools (SpaceClaim preferred, AutoCAD, Creo, or equivalent)
- Proficient with high-speed test equipment (VNA, TDR, BERT)
- Proficient with interconnect design or electronic packaging, with a preferred focus on high-speed differential connectors and/or cable assemblies, RF connectors, and channel integration.
- Proficient with printed circuit board layout and design (Altium preferred), fabrication and assembly, especially as associated with connector FP and card-edge interfaces
- Proficient with data analysis techniques, appreciation for design geometry tolerance impacts, and HVM qualification.
- Practiced analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem.
- Exposure to physical layer communications systems and architectures.
- Fluent in English (both verbal and written)
- Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies.
- Expert problem solver – able to solve high complexity situations with little to no direction. Proactive in identifying complex issues, providing solutions, and driving improvements to evolve procedures
- Proficient in presenting technical solutions to customers and upper management
- Demonstrated experience leading/developing a team of 4+ experienced professionals who exercise latitude and independence in their assignments with accountability for team performance, project delivery, and resource allocation.
- Proficient in building and leading a solid team - assessing talent fit (current team and future hires), aligning skills to business needs, identifying skillset gaps needed to strengthen the team, and taking actions necessary to maintain solid team performance.
- Demonstrated experience establishing and ensuring adherence to budgets, schedules, and work plans.
- Proficient at leading cross-functional new product development projects which require strong collaboration and influencing skills to achieve the right outcome for the business.
- Proficient in driving a data analytics mindset across the team – identifying the most meaningful data to collect, analyzing it, drawing conclusions, and presenting those conclusions as data intelligence to provide insight and drive innovative solutions for the business.
- Proficient in leading change in a high-paced and dynamic environment with an understanding of common barriers to effectively managing change.
- Proficient at driving continuous improvement with demonstrated experience implementing best practices to enhance engineering efficiency

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Nov 3, 2026
- Last checked: Nov 3, 2026
- Listed for: Under a day
- Location: Taiwan[Apply on TE Connectivity’s careers site →](https://careers.te.com/job/TAIPEI-MGR-II-R&DPRODUCT-DVL-ENGINEERING%28SI-ICC%29-TPQ-11070/1446666500/)

## Hiring at TE Connectivity
- Open jobs: 2,769
- New in the last 7 days: After two weekly collections
- Tracked since: Oct 13, 2026

[All TE Connectivity jobs](https://jobs.opennash.com/companies/te-connectivity/) · [Weekly hiring report](/reports/hiring/)

## More jobs at TE Connectivity

### [MGR II R&D/Product DVL Engineering (SI OTB)](https://jobs.opennash.com/companies/te-connectivity/jobs/51483a6c7f991898106c/)

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### [Principal R&D/Product DVL Engineer(SI ICC)](https://jobs.opennash.com/companies/te-connectivity/jobs/e826b49f2380b0240068/)

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### [Principal R&D/Product DVL Engineer(SI IO)](https://jobs.opennash.com/companies/te-connectivity/jobs/ab8c1aa7560549a48c71/)

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### [SR MGR R&D/PRODUCT DVL ENGINEERING (Bulk Cable)](https://jobs.opennash.com/companies/te-connectivity/jobs/72d12ed1cf958a2df858/)

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### [SR MGR R&D/Product DVL Engineering(ICC PDE)](https://jobs.opennash.com/companies/te-connectivity/jobs/409e189ff142ae83d1f3/)

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