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Renesas Electronics · Bengaluru, KA, India

# Staff Package Design Engineer

Bengaluru, KA, India Full-time Senior individual contributor Design 

Listed on Renesas Electronics’s official careers site. Posted October 7, 2026. Check that it is still open and apply there.
[Apply on Renesas Electronics’s careers site →](https://jobs.smartrecruiters.com/RenesasElectronics/744000154042759-staff-package-design-engineer)

[OpenNash Jobs](https://jobs.opennash.com/) / [Renesas Electronics](https://jobs.opennash.com/companies/renesas-electronics/) / Staff Package Design Engineer

## Job description

We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.

### Key Responsibilities

Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules. Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility. Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).

Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures. Work closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews. Ensure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS). Support ECO cycles, design updates, and version control throughout the project lifecycle.

## Qualifications

### Minimum Qualifications

6+ years of hands‑on experience in package CAD layout and development. Strong experience with 2.5D / 3D IC packaging, FCBGA and advanced substrate‑based packages, multi‑die and chiplet‑based designs.

Proficiency in industry‑standard tools such as: Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Innovator 3D IC, or equivalent. Experience working with advanced manufacturing design rules and interface with OSATs. Good understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals and High‑Speed Design concepts. Strong communication, presentation, and documentation skills with the ability to work effectively in a team environment.

## At a glance
- Posted by the employer: Oct 7, 2026
- First seen by OpenNash: Oct 12, 2026
- Last checked: Oct 19, 2026
- Listed for: 12 days
- Location: Bengaluru, KA, India
- Employment type: Full-time[Apply on Renesas Electronics’s careers site →](https://jobs.smartrecruiters.com/RenesasElectronics/744000154042759-staff-package-design-engineer)

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