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Renesas Electronics · Takasaki, Japan

# Sr Staff Engineer

Takasaki, Japan Full-time Senior individual contributor Operations 

Listed on Renesas Electronics’s official careers site. Posted October 15, 2026. Check that it is still open and apply there.
[Apply on Renesas Electronics’s careers site →](https://jobs.smartrecruiters.com/RenesasElectronics/744000155673769-sr-staff-engineer)

[OpenNash Jobs](https://jobs.opennash.com/) / [Renesas Electronics](https://jobs.opennash.com/companies/renesas-electronics/) / Sr Staff Engineer

## Job description
- Package Development & NPI Support
- Support package development activities for new Power MOSFET products including: TOLL / TOLG / TOLT Bottom-side cooled (BSC) Dual-side cooled (DSC) Top-side cooled (TSC). Advanced lead frame and clip-bond packages
- Define package requirements and specifications for new product development.
- Support package qualification and AEC-Q101 compliance activities.
- Drive package-related activities during NPI and product transition.
- Thermal & Mechanical Engineering
- Perform thermal analysis and package characterization.
- Conduct thermal resistance and thermal impedance measurements.
- Evaluate package reliability associated with: Power cycling Thermal cycling Solder joint reliability Mechanical stress
- Support package-level failure analysis and root cause investigation.
- Package Benchmarking & Technology Survey
- Benchmark competitor power package technologies.
- Analyze package construction, materials, and performance.
- Identify technology trends and recommend future package roadmaps.
- Conduct package reverse engineering and technical assessments.
- Simulation & Modeling
- Develop and maintain thermal simulation models.
- Support electrical and mechanical package simulations.
- Correlate simulation results with measurement data.
- Collaborate with system engineers on thermal optimization and system-level performance evaluation.
- Product & Customer Support

### Support customer inquiries regarding
- Thermal performance Package selection Reliability considerations
- Work with Application Engineering teams on customer design support.
- Develop package-related technical documentation and application notes.
- Cross-Functional Collaboration
- Coordinate package activities with: Design Engineering Product Engineering Reliability Engineering Manufacturing Marketing External package suppliers
- Participate in product definition reviews and technical decision-making.

## Qualifications

【MUST】 Thermal characterization and analysis Semiconductor package design fundamentals Reliability testing and qualification. Failure analysis techniques. Statistical data analysis. PCB and thermal design knowledge. 【WANT】 Thermal simulation tools: ANSYS Icepak ANSYS Mechanical FloTHERM Familiarity with: Automotive semiconductor requirements AEC-Q101 APQP/PPAP

## At a glance
- Posted by the employer: Oct 15, 2026
- First seen by OpenNash: Oct 12, 2026
- Last checked: Oct 19, 2026
- Listed for: 7 days
- Location: Takasaki, Japan
- Employment type: Full-time[Apply on Renesas Electronics’s careers site →](https://jobs.smartrecruiters.com/RenesasElectronics/744000155673769-sr-staff-engineer)

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