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Qualcomm · Hsinchu City, Taiwan

# Summer Intern- WiFi Physical Firmware Engineer

Hsinchu City, Taiwan Early career Software Engineering 

Listed on Qualcomm’s official careers site. Posted March 3, 2026. Check that it is still open and apply there.
[Apply on Qualcomm’s careers site →](https://careers.qualcomm.com/careers/job/446717043968)

[OpenNash Jobs](https://jobs.opennash.com/) / [Qualcomm](https://jobs.opennash.com/companies/qualcomm/) / Summer Intern- WiFi Physical Firmware Engineer

The employer’s listing has no description we could read. See it on their site.

## At a glance
- Posted by the employer: Mar 3, 2026
- First seen by OpenNash: Jul 10, 2026
- Last checked: Oct 20, 2026
- Listed for: 231 days
- Location: Hsinchu City, Taiwan[Apply on Qualcomm’s careers site →](https://careers.qualcomm.com/careers/job/446717043968)

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