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Qualcomm · Hsinchu City, Taiwan

# IC Packaging Substrate Engineer, up to Staff

Hsinchu City, Taiwan Senior individual contributor Operations 

Listed on Qualcomm’s official careers site. Posted November 2, 2026. Check that it is still open and apply there.
[Apply on Qualcomm’s careers site →](https://careers.qualcomm.com/careers/job/446721861072)

[OpenNash Jobs](https://jobs.opennash.com/) / [Qualcomm](https://jobs.opennash.com/companies/qualcomm/) / IC Packaging Substrate Engineer, up to Staff

The employer’s listing has no description we could read. See it on their site.

## At a glance
- Posted by the employer: Nov 2, 2026
- First seen by OpenNash: Nov 3, 2026
- Last checked: Nov 3, 2026
- Listed for: 1 day
- Location: Hsinchu City, Taiwan[Apply on Qualcomm’s careers site →](https://careers.qualcomm.com/careers/job/446721861072)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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