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Qualcomm · San Diego, CA

# Sr. Staff Packaging Engineer- Process Package Integrity & Bumping

San Diego, California, United States of America Senior individual contributor Operations 

Listed on Qualcomm’s official careers site. Posted September 25, 2026. Check that it is still open and apply there.
[Apply on Qualcomm’s careers site →](https://careers.qualcomm.com/careers/job/446721045103)

[OpenNash Jobs](https://jobs.opennash.com/) / [Qualcomm](https://jobs.opennash.com/companies/qualcomm/) / Sr. Staff Packaging Engineer- Process Package Integrity & Bumping

The employer’s listing has no description we could read. See it on their site.

## At a glance
- Posted by the employer: Sep 25, 2026
- First seen by OpenNash: Oct 13, 2026
- Last checked: Oct 20, 2026
- Listed for: 25 days
- Location: San Diego, California, United States of America[Apply on Qualcomm’s careers site →](https://careers.qualcomm.com/careers/job/446721045103)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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