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ON Semiconductor 

# Technician 4, Manufacturing

Seremban, Negeri Sembilan, Malaysia Skilled Trades & Maintenance 

Listed on ON Semiconductor ’s official careers site. Posted September 15, 2026. Check that it is still open and apply there.
[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506166)

[OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / Technician 4, Manufacturing

## Job description

### Position

TECHNICIAN 4, MANUFACTURING Job Summary: Onsemi is seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding. The role involves operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet Onsemi quality standards. Technicians will conduct routine checks, minor preventive maintenance, troubleshoot issues, and assist in process improvements.

Accurate data recording, adherence to 5S, safety, and ESD compliance, and strong teamwork are essential. Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields, possess basic troubleshooting skills, and are willing to work shifts in a fast-paced environment. Prior experience in semiconductor processes is an advantage.

## Responsibilities

### Responsibilities
- Operate and monitor die bond/clip bonder machines to ensure stable production output.
- Perform die/clip attach processes according to SOP, work instructions, and Onsemi quality standards.
- Machine model involve will be ASM (AD838, AD8312Plus, Alphsam),CB830,REFLOW, ASM DEK, VADU, & CREST, -Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
- Perform regular machine checks, cleaning, and minor preventive maintenance.
- Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
- Assist in troubleshooting equipment issues and support engineering improvement activities.
- Record production data accurately in system and ensure proper documentation.
- Ensure workplace 5S, safety compliance, and proper ESD handling at all times.

## Qualifications

Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields. Experience in semiconductor die attach/dieClip bonding / wire bonding process is an added advantage. Able to work in shift Basic troubleshooting and machine-handling skills. Good teamwork, discipline, and communication skills. Willing to learn and adapt in fast-paced production environment

## At a glance
- Posted by the employer: Sep 15, 2026
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 33 days
- Location: Seremban, Negeri Sembilan, Malaysia[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506166)

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