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ON Semiconductor · Shenzhen, Guangdong, China

# PIM (Si Gel Filled) Power Module Development Engineer

Shenzhen, Guangdong, China Operations 

Listed on ON Semiconductor ’s official careers site. Posted June 17, 2026. Check that it is still open and apply there.
[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2505758)

[OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / PIM (Si Gel Filled) Power Module Development Engineer

## Job description

New package technology and platform module development (Si-gel filled module). Technical leadership on new power module technology and enabling technology for automotive/industrial application. Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing and application team. Package/design review for new package development, on-tme release with the first pass success (qualification).

Present technical finding, design review and recommendation to stakeholders and management. Lead package related failure analysis, reliability testing and debug package issues. Participate in customer meeting, provide technical clarification and support failure investigation.

## Responsibilities

Define power module package strategy aligned with product roadmap. Own end-to-end package development from concept to qualification upon company's package development procedures. Ensure package reliability, performance, and manufacturability. Establish and optimize packaging processes and specifications. Collaborate with cross-functional teams (design, wafer fab, test, product engineering). Evaluate and introduce new packaging technologies and materials.

Manage risk, cost, and schedule for packaging programs. Support customer engagement for technical discussions and issue resolution. Serve as subject matter expert (SME) for packaging within the organization.

## Qualifications

Minium Bachelor's degree of material science or mechanical engineering. More than 8 years of power module package development experience including transfer to the production. Preferred Si gel filled module package development experience with SiC device. Good statistical analysis skills with Minitab or JMP. Preferred the knowledge to use Auto CAD software Good communication skills with English.

## At a glance
- Posted by the employer: Jun 17, 2026
- First seen by OpenNash: Jul 10, 2026
- Last checked: Oct 18, 2026
- Listed for: 123 days
- Location: Shenzhen, Guangdong, China[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2505758)

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