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ON Semiconductor 

# Engr II, Manufacturing Equip; MFG

Seremban, Negeri Sembilan, Malaysia Manufacturing & Production 

Listed on ON Semiconductor ’s official careers site. Posted October 8, 2026. Check that it is still open and apply there.
[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506882)

[OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / Engr II, Manufacturing Equip; MFG

## Job description

Die Clip Bonder Equipment Engineer We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM/CANON equipment and front end assembly processes.

## Responsibilities

### Technician Leadership

Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs.

### Machine Issue Follow-up

Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution.

### Equipment Maintenance & Calibration

Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime.

### Process Optimization

Monitor and analyze Overall Equipment Effectiveness (OEE), equipment Uptime, and Production Time to maximize line efficiency.

### Cost Optimization & Spare Parts Management

Monitor and reduce maintenance operational costs by optimizing spare parts inventory, evaluating second-source suppliers, and implementing component-level repairs to extend equipment lifespan.

### Continuous Improvement (Kaizen)

Lead and drive continuous improvement initiatives (such as Kaizen, 5S, and Lean Six Sigma projects) to eliminate waste, improve machine efficiency, and reduce recurring equipment failure rates.

### Yield & Waste Reduction

Collaborate with process engineering teams to analyze defect data, minimizing material waste and scrap during equipment setup, conversion, or buy-off phases.

### Documentation

Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.

## Qualifications

Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment: Die Bonder: ASM AD838, AD8312PLUS, DA D510, ALPHASAM Clip Bonder: AD830CB, AD830PLUS, BESTEM-C310 Reflow & Ovens: RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System)

### Screen Printe r

ASM DEK Cleaning Systems: CREST, Automated Optical Inspection (AOI): PENTAMASTER AOI

## At a glance
- Posted by the employer: Oct 8, 2026
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 10 days
- Location: Seremban, Negeri Sembilan, Malaysia[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506882)

## More jobs at ON Semiconductor 

### [Engr I, Manufacturing Equip; MFG](https://jobs.opennash.com/companies/on-semiconductor/jobs/5ce7a4e1b8f0edaa0d02/)

Seremban, Negeri Sembilan, Malaysia

### [Engr II, Manufacturing/ Automation Engineer](https://jobs.opennash.com/companies/on-semiconductor/jobs/8e452c4e2c87c848068d/)

Seremban, Negeri Sembilan, Malaysia

### [Engr II, Manufacturing; MFG](https://jobs.opennash.com/companies/on-semiconductor/jobs/2919f26cc1c928d4b488/)

Seremban, Negeri Sembilan, Malaysia

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