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ON Semiconductor · Zhubei, Hsinchu County, Taiwan

# GaN/BCD/Power Device Process Integration Engineer

Zhubei, Hsinchu County, Taiwan Operations 

Listed on ON Semiconductor ’s official careers site. Posted April 26, 2026. Check that it is still open and apply there.
[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2505250)

[OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / GaN/BCD/Power Device Process Integration Engineer

## Job description

### Job Summary

onsemi (Nasdaq: ON) is hiring a self-directed and self-driven GaN/BCD Process and Technology Development Engineer for external foundries.

## Responsibilities

### Process Integration
- Collaborate with R&D and foundry to develop/optimize GaN/BCD power devices and processes to deliver device manufacturability and production yield
- Work closely with foundry and multi-functional teams to bring up NPI Improvement of yield and quality: Perform advanced device characterization
- Conduct detailed yield analysis to identify failure modes.

Drive yield and quality improvement actions at defect and module levels at foundry Implement statistical process control (SPC) and design of experiments (DOE) methodologies to improve process yield.

### Project Management

Manage multiple projects, ensuring timely delivery to the solution and meet milestones. Coordinate with cross-functional teams to align project goals and deliverables.

## Qualifications

### Requirements

Education: MS or PhD in Electrical Engineering, Physics, or Material Science Experience: In-depth knowledge of GaN/BCD power device physics, process flow, integration and yield analysis. Module experience is a plus. Proven track record in new process development/optimization and/or yield improvement in GaN and BCD technologies Experience working with foundries RD/engineering/quality teams. Extensive experience with device reliability mechanisms, physical and device characterization techniques and failure analysis.

Experience of managing a full process of new product introduction, including test chip, tapeout, IP merges, masks, to deliver 1 st Silicon success, as well as enabling new technology joint development in external foundries.

### Soft Skills

Excellent written and verbal communication and presentation skills in English Strong project management abilities. Multi-tasking and good adaptability in a fast-changing environment. Ability to work in collaboration and in leadership. Self-driven, motivated, and excellent in problem solving skill with exceptional analytical and persuasion on directions.

## At a glance
- Posted by the employer: Apr 26, 2026
- First seen by OpenNash: Jul 10, 2026
- Last checked: Oct 18, 2026
- Listed for: 175 days
- Location: Zhubei, Hsinchu County, Taiwan[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2505250)

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