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ON Semiconductor · Lapu-Lapu City, Philippines

# Senior Prin, Package Design Engineer

Lapu-Lapu City, Philippines Senior individual contributor Design 

Listed on ON Semiconductor ’s official careers site. Posted March 4, 2026. Check that it is still open and apply there.
[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2504824)

[OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / Senior Prin, Package Design Engineer

## Job description

We are seeking a highly skilled and innovative Package Design Engineer to join our team. In this role, you will be responsible for designing cost-effective products that satisfy the customers' functional requirements and meet all design rules, quality and safety standards. Our ideal candidate will have an understanding of various semiconductor packaging materials, manufacturing processes and equipment, and will be experienced in CAD and other relevant design software.

## Responsibilities

Design and develop new innovative package designs that are cost-effective and satisfy customers' needs. Coordinate with cross-functional teams to ensure package designs meet all product specifications and requirements. Create package design concepts and present to the management. Ensure package designs are compliant with design rules, industry and environmental regulations. Create or request 3D models of new package designs and initiate request for FEA simulations (electrical, thermal or mechanical).

Work with material and equipment suppliers to review the related designs. Ensure all related engineering drawings are in-place and documented prior procurement and product release. Document all stages of the package design process for future reference and improvements including design rules specifications and DFMEA. Address any package design issues and implement necessary changes. Support all design needs from manufacturing site.

## Qualifications

Proven work experience as a Package Design Engineer or similar role in packaging design or development. Proficiency in CAD specifically AutoCAD, Solidworks and other packaging design software. Strong background on packaging materials, manufacturing processes and equipment. Bachelor’s degree in engineering, Material Science, Industrial Design, or other related field. Strong problem-solving skills and leadership. Excellent communication and presentation skills.

## At a glance
- Posted by the employer: Mar 4, 2026
- First seen by OpenNash: Jul 10, 2026
- Last checked: Oct 18, 2026
- Listed for: 228 days
- Location: Lapu-Lapu City, Philippines[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2504824)

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