[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All ON Semiconductor jobs](https://jobs.opennash.com/companies/on-semiconductor/) · [Search jobs](/search/) ON Semiconductor · Selangor, Malaysia # External Manufacturing NPI Manager Selangor, Malaysia Manager or lead Manufacturing & Production Listed on ON Semiconductor ’s official careers site. Posted March 9, 2026. Check that it is still open and apply there. [Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2504720) [OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / External Manufacturing NPI Manager ## Job description External Manufacturing NPI Manager ## Responsibilities Own backend external manufacturing NPI from conceptualization, development, qualification to production launch Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release Responsible for the team’s performance, including overall delivery, tactical & resource planning, execution and day-to-day operationalization Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release - Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development - Lead by example and adoption of data analytics and data-driven approach to problem solving and decision making Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production ## Qualifications - Bachelor's Degree in Engineering/ Materials Science or equivalent technical background More than - 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience - Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings Experience in leading and mentoring a highly technical and motivated team of 10+ NPI/ process engineers Hands-on assembly process experience in leading wafer technology such as SiC, JFET, GaN and CIS Imaging is highly desirable Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect Experience in IC package design/ CAD/ simulation/ characterization will be advantageous Good overall understanding of OSAT business landscape, operations and industry trends Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills - Proficient in statistical analysis methods and familiar with data analytics Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous ## At a glance - Posted by the employer: Mar 9, 2026 - First seen by OpenNash: Jul 10, 2026 - Last checked: Oct 18, 2026 - Listed for: 223 days - Location: Selangor, Malaysia[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2504720) ## More jobs at ON Semiconductor ### [Conversion Intern for Korea MFG](https://jobs.opennash.com/companies/on-semiconductor/jobs/bf085ba5c29bf01df690/) Bucheon-si, Gyeonggi-do, Korea, Republic of ### [DEFECT Process engineer](https://jobs.opennash.com/companies/on-semiconductor/jobs/cd6afbf590b33c5226f1/) Aizuwakamatsu-Shi, Fukushima, Japan ### [Director, Furnace, Thin Films, Epi, CMP & Implant](https://jobs.opennash.com/companies/on-semiconductor/jobs/7beb8464e1cc07899a78/) Hopewell Junction, NY, United States ### [Engr I, Manufacturing Equip; MFG](https://jobs.opennash.com/companies/on-semiconductor/jobs/5ce7a4e1b8f0edaa0d02/) Seremban, Negeri Sembilan, Malaysia ### [Engr II, Manufacturing Equip; MFG](https://jobs.opennash.com/companies/on-semiconductor/jobs/271c20e6c2da5b2996e0/) Seremban, Negeri Sembilan, Malaysia ## Similar jobs at other companies ### [Senior Manager, External Manufacturing Operations](https://jobs.opennash.com/companies/thermo-fisher-scientific/jobs/9df45e07fa9f34516a4c/) Thermo Fisher Scientific · Singapore ### [External Manufacturing NPI Project Lead](https://jobs.opennash.com/companies/corning/jobs/37c38601428bce999c88/) Corning · Gurgaon, HR, IN ### [External Manufacturing NPI Project Manager](https://jobs.opennash.com/companies/corning/jobs/f45175099a3c39cea6b9/) Corning · Shanghai, SH, CN ### [NPI Manufacturing Engineer](https://jobs.opennash.com/companies/resmed/jobs/eb62e61a8a14d32e1a78/) ResMed · Johor Bahru, Malaysia ### [Senior Quality Engineer - External Manufacturing_ Electronics (Mie or Shizuoka or Tokyo)](https://jobs.opennash.com/companies/merck-kgaa-germany/jobs/5f69c1f2300ba36c3550/) Merck KGaA, Darmstadt, Germany and its affiliates · Shizuoka, Japan [Manufacturing & Production jobs](/functions/manufacturing-production/) OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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