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ON Semiconductor 

# Engr II, Manufacturing Equip; MFG

Seremban, Negeri Sembilan, Malaysia Manufacturing & Production 

Listed on ON Semiconductor ’s official careers site. Posted July 21, 2026. Check that it is still open and apply there.
[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506028)

[OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / Engr II, Manufacturing Equip; MFG

## Job description

We are seeking an experienced and highly technical Senior Equipment Engineer to lead our front end assembly equipment team. You will be responsible for leading shift technicians, ensuring maximum equipment uptime, and performing advanced troubleshooting across our die bond, clip bond, reflow, and inspection lines. The ideal candidate must have strong hands-on engineering experience with ASM equipment and front end assembly processes.

## Responsibilities

### Technician Leadership

Lead, supervise, and mentor a team of shift technicians to ensure strict adherence to maintenance schedules and production KPIs.

### Machine Issue Follow-up

Take ownership of chronic, unresolved, or escalated machine issues handed over from previous shifts, conducting deep-dive root cause analysis for permanent resolution.

### Equipment Maintenance & Calibration

Oversee and execute corrective and preventive maintenance (PM) for die attach, clip bond, reflow, oven, and AOI equipment to minimize downtime.

### Process Optimization

Monitor Overall Equipment Effectiveness (OEE),Uptime,production time.

### Documentation

Establish, review, and update Standard Operating Procedures (SOP), troubleshooting matrices, and technical training materials for the engineering team.

## Qualifications

Candidates must have hands-on experience in operation, setup, troubleshooting, or maintenance for the following equipment: Die Bonder: ASM AD838, AD8312PLUS, DA D510, ALPHASAM Clip Bonder: AD830CB, AD830PLUS, BESTEM-C310 Reflow & Ovens: RO830, RO832, BOCS-6 (Reflow), PINK VADU (Vacuum Soldering System)

### Screen Printer

ASM DEK Cleaning Systems: CREST, Automated Optical Inspection (AOI): PENTAMASTER AOI Requirements: Education: Bachelor’s Degree in Mechanical, Mechatronics, Electrical, or Electronic Engineering.

### Experience

Minimum 3–5+ years of solid engineering experience in semiconductor Front assembly (Die Bond / Clip Bond line preferred).

### Technical Skills

Expertise in ASM die bond platforms, Solder Phasa bonding mechanisms, and vision systems. Proficient in engineering problem-solving tools (8D, FMEA, SPC, 5-Why, Fishbone).

### Leadership

Proven track record of managing shift technicians and driving team performance under pressure.

### Working Hours

Must be willing to support shift teams, handle escalations, and work flexible hours when required.

## At a glance
- Posted by the employer: Jul 21, 2026
- First seen by OpenNash: Oct 11, 2026
- Last checked: Oct 18, 2026
- Listed for: 89 days
- Location: Seremban, Negeri Sembilan, Malaysia[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2506028)

## More jobs at ON Semiconductor 

### [Engr I, Manufacturing Equip; MFG](https://jobs.opennash.com/companies/on-semiconductor/jobs/5ce7a4e1b8f0edaa0d02/)

Seremban, Negeri Sembilan, Malaysia

### [Engr II, Manufacturing/ Automation Engineer](https://jobs.opennash.com/companies/on-semiconductor/jobs/8e452c4e2c87c848068d/)

Seremban, Negeri Sembilan, Malaysia

### [Engr II, Manufacturing; MFG](https://jobs.opennash.com/companies/on-semiconductor/jobs/2919f26cc1c928d4b488/)

Seremban, Negeri Sembilan, Malaysia

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