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ON Semiconductor 

# Device Engineer

Aizuwakamatsu-Shi, Fukushima, Japan Operations 

Listed on ON Semiconductor ’s official careers site. Posted October 1, 2026. Check that it is still open and apply there.
[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2505764)

[OpenNash Jobs](https://jobs.opennash.com/) / [ON Semiconductor ](https://jobs.opennash.com/companies/on-semiconductor/) / Device Engineer

## Job description

Background Driven by strong and growing demand for power semiconductor devices, particularly in AI-related applications, improving factory productivity has become an urgent priority. We are seeking talented engineers who can contribute broadly as Device Engineering / Process Integration Engineers, supporting activities ranging from new technology development and new product introduction to yield/quality improvement of mass production products, process optimization, cost reduction, and troubleshooting.

## Responsibilities

Roles & Responsibilities In an 8-inch wafer fabrication facility, you will act as a technology owner for Analog IC processes, leveraging expertise in device engineering and process integration to drive development and manufacturing excellence.
- Lead and execute development and transfer projects for new technologies and new products
- Improve product quality and yield through process design and optimization from development through mass production
- Drive continuous improvement of quality, yield, and reliability for existing mass production products, contributing to technology robustness, cost reduction, and productivity enhancement
- Manage manufacturing conditions for production products (Control Plans, FMEA, SPC)
- Perform root cause analysis of issues and implement corrective actions based on risk management, including recurrence prevention (8D, FTA, Why-Why analysis, Risk Assessment, etc.)

### Key Relationship Direct Report

Manager, Device Engineering Department Key Interfaces: Engineers and managers within Aizu Wafer Fab, Global Engineering Teams

## Qualifications

Qualifications (Required)
- Bachelor’s degree or higher in engineering or a related field Experience in device engineering or process integration in a semiconductor wafer fabrication environment (Minimum ~5 years) Fundamental knowledge of IC processes, device physics, electrical characteristics/testing, analog IC circuits, and reliability Understanding of product specifications (SPEC) and design margin concepts Hands-on experience in data analysis (yield, electrical characteristics, defect/failure analysis) and strong problem-solving skills Practical experience in identifying root causes and implementing corrective actions for yield loss or performance issues Experience leading cross-functional projects involving manufacturing, process engineering, design/product development, quality, and backend operations
- Ability to communicate effectively in English (email and web meetings) with global teams and U.S. headquarters Business-level English proficiency (e.g., TOEIC score of ~600 or higher) Japanese language proficiency (equivalent to JLPT N2 level or above) Valid work authorization that permits employment in Japan at the time of application No visa sponsorship available for this position Preferred Qualifications Experience as a technical lead or engineer in new technology development or technology transfer projects Experience in semiconductor circuit design, device simulation, or test development
- Knowledge and hands-on experience with semiconductor front-end processes and equipment Leadership experience in yield improvement or process optimization projects
- Ability to communicate effectively in technical discussions in English meetings Experience working in a multinational or global company environment is a plus Experience in driving process optimization and business improvement using AI technologies Ideal Candidate Profile Continuously improves personal skills and can adapt to broader and deeper technical responsibilities
- Understands factory and departmental KPIs and is committed to achieving them
- Demonstrates strong ownership of products/technologies and drives problem-solving and improvements through to completion Able to identify root causes and solve problems logically and systematically Proactively identifies risks and implements preventive actions through risk assessment Effectively communicates and collaborates across teams, influencing and leading stakeholders
- Demonstrates flexibility and a positive attitude toward change and new technologies Possesses a customer-oriented mindset and understands on-site realities, making decisions based on overall optimization rather than partial optimization

## At a glance
- Posted by the employer: Oct 1, 2026
- First seen by OpenNash: Jul 10, 2026
- Last checked: Oct 18, 2026
- Listed for: 100 days
- Location: Aizuwakamatsu-Shi, Fukushima, Japan[Apply on ON Semiconductor ’s careers site →](https://hctz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1001/job/2505764)

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