[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All NXP Semiconductors jobs](https://jobs.opennash.com/companies/nxp-semiconductors/) · [Search jobs](/search/) NXP Semiconductors · Chandler +2 more # Senior Principal Packaging Engineer Chandler +2 more Full-time Senior individual contributor Operations Listed on NXP Semiconductors’s official careers site. Posted October 14, 2026. Check that it is still open and apply there. [Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Chandler-Office/Senior-Principal-Packaging-Engineer_R-10067082) [OpenNash Jobs](https://jobs.opennash.com/) / [NXP Semiconductors](https://jobs.opennash.com/companies/nxp-semiconductors/) / Senior Principal Packaging Engineer ## Job description The Semiconductor Packaging Engineer will serve as an experienced technical lead within NXP’s Package Innovation organization, defining and delivering package solutions for new products and new technologies across NXP business lines. This role provides standard and advanced packaging solutions to support NXP markets including vehicle electrification and power management, robotics, and high-performance compute/datacenters, with focus on analog and power delivery. ### Job Summary Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost. Drive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, internal assembly sites, OSATs, material suppliers, and external technology partners. Monitor industry trends in advanced packaging, panel-level packaging (PLP), and power packaging. Define and drive associated technology roadmaps. Ensure package deliverables are met for New Product Introductions (NPI) and New Technology Introductions (NTI), including feasibility assessment, package design, prototype builds, characterization, qualification, risk retirement, release, and production ramp support. May involve international travel to NXP assembly sites, OSATs, suppliers, and technology partners. ### Job Qualifications B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field. 10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields. Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages. Experience leading cross-functional technical projects with contributors from multiple engineering, co-design, manufacturing, product, quality, supplier, and management organizations. Ability to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences. Fluent English communication skills, written and verbal. Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred. More information about NXP in the United States... NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-97b2 ## At a glance - Posted by the employer: Oct 14, 2026 - First seen by OpenNash: Oct 19, 2026 - Last checked: Oct 19, 2026 - Listed for: 5 days - Location: Chandler +2 more - Employment type: Full-time[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Chandler-Office/Senior-Principal-Packaging-Engineer_R-10067082) ## More jobs at NXP Semiconductors ### [(Senior) RF Engineer mmW Innovation (f/m/d)](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/8d1b076de67be2fa75e2/) Hamburg ### [(Sr.) Product Engineer](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/35902b4d2fd8623622ac/) Kaohsiung ### [2026 Campus- MCU Systems Engineer](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/0b5e5143ff07b6924594/) ### [2026 Intern - Information System Engineer](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/40450274455adcc635f5/) Tianjin ## Similar jobs at other companies ### [Packaging SIPI Engineer, Principal Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/bffdc129159ceeeb0f29/) Qualcomm · San Diego, California, United States of America ### [Sr Staff or Principal Thermal Engineer, Server Packaging (San Diego)](https://jobs.opennash.com/companies/qualcomm/jobs/7752f8777c35890d2c8d/) Qualcomm · San Diego, California, United States of America ### [Packaging Engineer](https://jobs.opennash.com/companies/lockheed-martin/jobs/f38ca6ceee0f57f954b3/) Lockheed Martin · Orlando, FL ### [Packaging Engineer](https://jobs.opennash.com/companies/lockheed-martin/jobs/1d0d0b3f409418a14512/) Lockheed Martin · Grand Prairie, TX ### [Packaging Engineer](https://jobs.opennash.com/companies/northrop-grumman/jobs/f4b34d78c1347098a0a7/) Northrop Grumman · United States-Maryland-Elkridge OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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