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NXP Semiconductors · Kuala Lumpur

# Equipment Technician for Wire Bond

Kuala Lumpur Skilled Trades & Maintenance 

Listed on NXP Semiconductors’s official careers site. Posted October 8, 2026. Check that it is still open and apply there.
[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Kuala-Lumpur/Equipment-Technician-for-Wire-Bond_R-10067096)

[OpenNash Jobs](https://jobs.opennash.com/) / [NXP Semiconductors](https://jobs.opennash.com/companies/nxp-semiconductors/) / Equipment Technician for Wire Bond

## Job description

Attend to wire bond equipment to #LI-DNI

## At a glance
- Posted by the employer: Oct 8, 2026
- First seen by OpenNash: Oct 12, 2026
- Last checked: Oct 19, 2026
- Listed for: 11 days
- Location: Kuala Lumpur[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Kuala-Lumpur/Equipment-Technician-for-Wire-Bond_R-10067096)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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