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NXP Semiconductors · Kuala Lumpur

# Package Roadmap Tool Intern – Package Innovation

Kuala Lumpur Early career 

Listed on NXP Semiconductors’s official careers site. Listed as of October 19, 2026. Check that it is still open and apply there.
[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Kuala-Lumpur/Package-Roadmap-Tool-Intern---Package-Innovation_R-10066735)

[OpenNash Jobs](https://jobs.opennash.com/) / [NXP Semiconductors](https://jobs.opennash.com/companies/nxp-semiconductors/) / Package Roadmap Tool Intern – Package Innovation

## Job description

Package Roadmap Tool Intern – Package Innovation

### Role Summary

Develop and enhance tools to enable structured definition, visualization, and management of package technology roadmaps across platforms.

### Key Responsibilities
- Design and implement a Package Roadmap Tool to track technology evolution, capabilities, and platform alignment
- Participate and support Platform Manager lead to integrate inputs from business lines, competitive analysis, and supplier data into a centralized roadmap framework
- Improve data structure, usability, and automation of roadmap tracking (e.g., dashboards, visualizations)
- Participate and support Platform Manager lead for roadmap reviews and ensure alignment with PI strategy, cost targets, and technology readiness
- Collaborate cross-functionally with platform, API, and manufacturing teams

### Additional Exposure
- Participate in ATKL manufacturing projects to build foundational knowledge of package assembly and process flows Qualifications Degree candidate in Computer Science (preferred), Engineering, or related field
- Strong programming and data structuring skills (e.g., Python, data tools, automation frameworks) Experience with Excel, Power BI, or similar tools for visualization and tool development
- Ability to translate technical inputs into structured, scalable frameworks Self-driven with strong collaboration and communication skills More information about NXP in Malaysia... #LI-633a

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 12, 2026
- Last checked: Oct 19, 2026
- Listed for: 7 days
- Location: Kuala Lumpur[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Kuala-Lumpur/Package-Roadmap-Tool-Intern---Package-Innovation_R-10066735)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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