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NXP Semiconductors · Kuala Lumpur

# External Package Innovation Engineer

Kuala Lumpur Operations 

Listed on NXP Semiconductors’s official careers site. Listed as of October 19, 2026. Check that it is still open and apply there.
[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Kuala-Lumpur/External-Package-Innovation-Engineer_R-10065834-1)

[OpenNash Jobs](https://jobs.opennash.com/) / [NXP Semiconductors](https://jobs.opennash.com/companies/nxp-semiconductors/) / External Package Innovation Engineer

## Job description

### Hiring

External Package Innovation Engineer We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution. 🔹 Role Overview As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production. 🔹 Key Responsibilities ✅ 1.

Role Owner (Strategic & Governance)
- Own and lead OSAT-wide and cross-OSAT initiatives
- Define and deploy standard development templates and success criteria across OSATs
- Drive deployment of Best Known Methods (BKM) and lessons learned
- Develop and maintain technology roadmap and capability assessment for each OSAT site Provide Package Innovation (PI) input for: External site sourcing strategy Site selection process (jointly with interface manager)

### Lead project governance, including

Overall project summaries Stoplight reporting Regular reviews per OSAT site ✅ 2.

Supporter (Execution & Project Delivery) Support NPI & NTI projects executed at external OSAT factories Ensure OSAT compliance with: Development processes Required documentation/templates
- Drive alignment on SME (Subject Matter Expert) assignment at OSAT Support and resolve technical and project issues on-site and across time zones
- Ensure assembly readiness and safe production launch 🔹 Stakeholder Collaboration You will work closely with cross-functional teams, including: Project Leaders & Development Managers Designers & Materials Engineers Tech Integration & Modelling teams (Electrical, Mechanical, Thermal) API and WLP/PLP/FC SMEs OSAT partners 🔹 What We’re Looking For Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).

Previous exposure to OSAT ecosystem is an added advantage.
- Proven ability to manage cross-site, cross-functional projects
- Solid understanding of NPI/NTI development flows
- Excellent stakeholder management and communication skills
- Ability to drive standardization, governance, and technical problem-solving 🌟 Why Join Us Opportunity to lead high-impact package innovation initiatives
- Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drive technology roadmap and next-generation packaging solutions More information about NXP in Malaysia... #LI-633a

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 12, 2026
- Last checked: Oct 19, 2026
- Listed for: 7 days
- Location: Kuala Lumpur[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Kuala-Lumpur/External-Package-Innovation-Engineer_R-10065834-1)

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