[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All NXP Semiconductors jobs](https://jobs.opennash.com/companies/nxp-semiconductors/) · [Search jobs](/search/) NXP Semiconductors · Singapore # Global OSAT Operation Engineering Singapore Operations Listed on NXP Semiconductors’s official careers site. Listed as of October 19, 2026. Check that it is still open and apply there. [Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Singapore/Global-OSAT-Operation-Engineering_R-10066685-1) [OpenNash Jobs](https://jobs.opennash.com/) / [NXP Semiconductors](https://jobs.opennash.com/companies/nxp-semiconductors/) / Global OSAT Operation Engineering ## Job description ### Job Responsibilities Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites. Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization. Review and approve subcontractor 8D, CQC, Safe Launch reports, PCN submissions, and corrective/preventive action plans. Drive qualification and implementation of subcontractor changes including material, equipment, process, manufacturing site, floor layout, and capacity expansion for supply assurance. Lead OSAT site transfer, second-source qualification, and capacity expansion projects for supply resilience and revenue growth. Own qualification planning, gap assessment, risk mitigation, Safe Launch execution, and PCN activities. Partner with global Product Engineering, Quality, Reliability, Supply Chain, and Manufacturing teams to ensure successful project execution and product commercialization. Lead supplier technical assessments, capability benchmarking, and readiness reviews for new and existing OSAT partners. Lead onsite root cause investigations and resolution of major quality incidents, yield excursions, customer issues, and severe incident escalations. Support package documentation management, including bond diagrams, package kits, assembly flows, qualification reports, and change records. Participate as Change Action Board (CAB), Independent Review Board(IRB), and qualification review member for NPI/NTI, site transfer, and process change approvals. Champion Smart Factory initiatives by working with OSATs on AI/ML deployment, predictive analytics, automated defect detection, and manufacturing digitalization solutions. Provide regular executive updates and recommendations to management on qualification status, supply risks, quality performance, and strategic OSAT initiatives. ### Requirements Degree or MSc Degree in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent. Minimum 8-10 years of semiconductor assembly and packaging experience, preferably in OSAT management, site transfer, and qualification projects. Technical knowledge in advanced packaging technologies such as WLCSP, FOWLP, Cu Pillar Bumping, and Flip-Chip. Additional experience in mainstream semiconductor packages including QFN, LQFP, and wire bond technologies will be an added advantage. Experience in package qualification, Safe Launch execution, change management (PCN), and subcontractor management. Knowledge of DOE, SPC, FDC, process control methodologies, reliability qualification, and root cause analysis techniques. Proven experience in yield improvement, quality management, and manufacturing productivity enhancement. Strong project management, leadership, and stakeholder management skills in a cross-functional global environment. Good communication and presentation skills with the ability to influence stakeholders at all organizational levels. Ability to work independently, manage multiple priorities, and drive projects to closure under tight timelines. Familiarity with AI/ML, Smart Factory, Industry 4.0 initiatives, and manufacturing digitalization is an added advantage. More information about NXP in Singapore... #LI-6a60 ## At a glance - Posted by the employer: Not stated - First seen by OpenNash: Oct 12, 2026 - Last checked: Oct 19, 2026 - Listed for: 7 days - Location: Singapore[Apply on NXP Semiconductors’s careers site →](https://nxp.wd3.myworkdayjobs.com/careers/job/Singapore/Global-OSAT-Operation-Engineering_R-10066685-1) ## More jobs at NXP Semiconductors ### [Principal Tape Out Engineer](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/b7407d7465161fa606cd/) Singapore ### [Senior Principal Foundry Engineer](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/98019cdc9b058b7f10d4/) Singapore ### [Senior Principal Foundry Engineer - HV/BCD Process Integration](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/7c76c78808968c7689f4/) Singapore ### [Senior Principal Foundry Engineer - Product Engineering](https://jobs.opennash.com/companies/nxp-semiconductors/jobs/98e02d193039a415c1ab/) Singapore ## Similar jobs at other companies ### [OSAT Capacity Planning Manager](https://jobs.opennash.com/companies/marvell-technology/jobs/a6b5f016c5b450e961d1/) Marvell Technology · Singapore ### [OSAT Operations Senior Staff Planner](https://jobs.opennash.com/companies/marvell-technology/jobs/93c1107f9515e4151aa7/) Marvell Technology · Singapore ### [TW Engineer - FS I, OSAT](https://jobs.opennash.com/companies/lam-research/jobs/0dd9e2e05615bf19abd6/) Lam Research · Taichung, TW ### [TW Engineer - FS II, OSAT](https://jobs.opennash.com/companies/lam-research/jobs/8bcb3e9a3e11fa7d6133/) Lam Research · Hsinchu, TW ### [東京/技術開発/半導体パッケージ委託先（Osat）の管理と技術リード/リーダー候補](https://jobs.opennash.com/companies/asahi-kasei/jobs/8de111df49046a970c10/) Asahi Kasei OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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