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Nokia · United States

# PIC Process Integration Engineer

United States Operations 

Listed on Nokia’s official careers site. Posted May 5, 2026. Check that it is still open and apply there.
[Apply on Nokia’s careers site →](https://fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1/job/23507)

[OpenNash Jobs](https://jobs.opennash.com/) / [Nokia](https://jobs.opennash.com/companies/nokia/) / PIC Process Integration Engineer

## Job description

We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement.

## Responsibilities

### Fab Bring-Up & Equipment Qualification

Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones.

### Process Development & Integration

Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow.

### Yield & Reliability Engineering

Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology.

### Cross-Functional Collaboration

Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets.

### Documentation & Technology Transfer

Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production.

## Qualifications

BS/MS/PhD in Electrical Engineering, Materials Science, or related field. Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics. Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices. Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support. Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages.

Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus. Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.

### What We Offer

A chance to contribute to cutting-edge photonic technologies in a globally recognized company. A collaborative, innovative work environment with multidisciplinary technical teams. The opportunity to directly impact the development of high-performance optical networking solutions at Nokia. If you're passionate about advancing optical communication technology and eager to tackle challenging technical problems in PIC development, we invite you to apply.

## At a glance
- Posted by the employer: May 5, 2026
- First seen by OpenNash: Oct 13, 2026
- Last checked: Oct 20, 2026
- Listed for: 168 days
- Location: United States[Apply on Nokia’s careers site →](https://fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1/job/23507)

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