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Nokia · United States

# Mechanical Packaging Engineer Co-op

United States On-site Full-time Early career Skilled Trades & Maintenance 

Listed on Nokia’s official careers site. Posted October 16, 2026. Check that it is still open and apply there.
[Apply on Nokia’s careers site →](https://fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1/job/40850)

[OpenNash Jobs](https://jobs.opennash.com/) / [Nokia](https://jobs.opennash.com/companies/nokia/) / Mechanical Packaging Engineer Co-op

## Job description

### Number of Positions

1 Date: Jan 2027 - Apr 2027 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.

## Responsibilities

Perform mechanical integrity and thermal simulations, tolerance analyses and characterization. Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings. Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements. Drive package debug activities during product validation and qualification.

## Qualifications

Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software. Experience with thermal and thermo-mechanical simulations using ANSYS or similar software. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

### It would be nice if you also had

Knowledge of design for manufacturing of 2.5D/3D packaging. Experience in high-speed electronics package design and/or laser package design. Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience. Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

## At a glance
- Posted by the employer: Oct 16, 2026
- First seen by OpenNash: Oct 20, 2026
- Last checked: Oct 20, 2026
- Listed for: 4 days
- Location: United States
- Work arrangement: On-site
- Employment type: Full-time[Apply on Nokia’s careers site →](https://fa-evmr-saasfaprod1.fa.ocs.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX_1/job/40850)

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