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Midea Group · 上海市-上海市

# 电控开发高级工程师

上海市-上海市 

Listed on Midea Group’s official careers site. Posted October 15, 2026. Check that it is still open and apply there.
[Apply on Midea Group’s careers site →](https://recruit.midea.com/recruitOut/ihr/jobApplication?positionId=8b8b322fa0ce189601a1260b96432c47&recruitType=social)

[OpenNash Jobs](https://jobs.opennash.com/) / [Midea Group](https://jobs.opennash.com/companies/midea-group/) / 电控开发高级工程师

## Job description
- 负责人形机器人关节模组伺服驱动器硬件研发，主导系统方案、拓扑选型、电路仿真、原理图与多层 PCB 设计，攻克小体积高功率密度硬件难点。
- 主导硬件设计全流程管控，维护图纸、BOM、DFMEA，输出测试报告与各类量产技术文档。
- 牵头 EMC、高低温、振动等可靠性与认证测试，定位硬件问题并落地整改方案，满足关节模组严苛工况。
- 输出硬件生产及工艺文件，对接产线，主导可制造性优化，解决量产硬件问题，提升良率。
- 参与关节模组整机硬件架构与电气联调，协同电机、结构、算法团队优化匹配，沉淀研发规范。 1、本科及以上，电力电子、电气传动、自动化、电机等相关专业，扎实的电力电子与电路理论基础。 2、精通伺服硬件开发流程，熟练使用 Altium Designer/Cadence、PSIM/Pspice 等仿真与 PCB 设计工具。 3、5 年以上伺服硬件开发经验，具备完整伺服产品从方案、样机、认证到量产的项目落地经验。 4、熟悉小体积高功率密度伺服拓扑，有人形 / 协作机器人关节伺服硬件开发量产经验优先。 5、较强硬件故障排查与技术攻坚能力，良好跨部门沟通能力，严谨务实，具备方案评审能力。

## At a glance
- Posted by the employer: Oct 15, 2026
- First seen by OpenNash: Oct 19, 2026
- Last checked: Oct 19, 2026
- Listed for: 4 days
- Location: 上海市-上海市[Apply on Midea Group’s careers site →](https://recruit.midea.com/recruitOut/ihr/jobApplication?positionId=8b8b322fa0ce189601a1260b96432c47&recruitType=social)

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Dates come from the employer where stated; “first seen” and “last checked” are our own observations.

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