[Skip to main content](#main-content) [OpenNash Jobs](https://jobs.opennash.com/) [Hiring report](/reports/hiring/) · [All Micron Technology jobs](https://jobs.opennash.com/companies/micron-technology/) · [Search jobs](/search/) Micron Technology · Richardson, TX # Intern - Engineer, HIG HBM DTPCO Richardson, TX Full-time Early career Operations Listed on Micron Technology’s official careers site. Posted October 6, 2026. Check that it is still open and apply there. [Apply on Micron Technology’s careers site →](https://micron.wd1.myworkdayjobs.com/External/job/Richardson-TX/Intern---Engineer--HIG-HBM-DTPCO_JR113618) [OpenNash Jobs](https://jobs.opennash.com/) / [Micron Technology](https://jobs.opennash.com/companies/micron-technology/) / Intern - Engineer, HIG HBM DTPCO ## Job description Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality. This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations. ### Responsibilities Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards. Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, timing margin evaluation, and failure-onset analysis. Develop and maintain Python-, Verilog-, and C/C++-based test programs, stress patterns, workloads, and observability features to accelerate root-cause investigations and improve characterization efficiency. Analyze MBIST signatures and multifaceted electrical, thermal, and mechanical datasets to identify root causes related to design, process, package, assembly, or test interactions, and recommend corrective actions. Leverage AI, Agentic AI, and Generative AI tools to improve engineering workflows, data analysis, test development efficiency, and problem-solving effectiveness. ### Minimum Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field. 3+ years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a related field. Hands-on experience with laboratory equipment such as oscilloscopes, SMUs, power supplies, thermal systems, probe stations, or automated test hardware. Programming experience in Python and at least one additional language such as C/C++ or Verilog. Experience analyzing complex datasets and driving root-cause investigations using statistical and engineering methods. ### Preferred Qualifications Master's or PhD degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related field. Experience with DRAM, HBM, memory subsystems, advanced semiconductor packaging, or silicon characterization. Knowledge of thermal, mechanical stress, reliability, yield improvement, DOE methodologies, and power-performance correlation techniques. Experience working with MBIST analysis, parametric characterization, failure signatures, and semiconductor test methodologies. Proficiency using AI-enabled tools, Agentic AI, Generative AI, or AI-assisted coding platforms (e.g., Claude Code, Code Assist) to improve engineering productivity, data analysis, and workflow automation. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. ### AI alert Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. ### Fraud alert Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc. ## At a glance - Posted by the employer: Oct 6, 2026 - First seen by OpenNash: Oct 11, 2026 - Last checked: Oct 18, 2026 - Listed for: 12 days - Location: Richardson, TX - Employment type: Full-time[Apply on Micron Technology’s careers site →](https://micron.wd1.myworkdayjobs.com/External/job/Richardson-TX/Intern---Engineer--HIG-HBM-DTPCO_JR113618) ## More jobs at Micron Technology ### [Foundry PDK / Collateral Integration Engineer (CAD/EDA)](https://jobs.opennash.com/companies/micron-technology/jobs/e29a94a485fd3af9bdd2/) Richardson, TX ### [MTS - HBM Thermal Integration Engineer](https://jobs.opennash.com/companies/micron-technology/jobs/659cd02866b54dfc5b41/) Richardson, TX ### [MTS - Thermal Simulation Engineer](https://jobs.opennash.com/companies/micron-technology/jobs/dcdb4c8c327118e807e3/) Richardson, TX ### [Principal Engineer - HIG HBM - ARCHITECTURE](https://jobs.opennash.com/companies/micron-technology/jobs/c49f01c151ef0fb0c911/) Richardson, TX ### [Principal Engineer, CE CAD](https://jobs.opennash.com/companies/micron-technology/jobs/2e1edd19a8690b85878f/) Richardson, TX ## Similar jobs at other companies ### [Next-Gen, High-Speed HBM, LPDDR Memory Controller ASIC Digital Design Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/fc7941a2f0e160116c2c/) Qualcomm · San Diego, California, United States of America ### [Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer](https://jobs.opennash.com/companies/qualcomm/jobs/18ad20632b3d36574f05/) Qualcomm · San Diego, California, United States of America ### [Principal Engineer, HBM Field Application](https://jobs.opennash.com/companies/sk-hynix/jobs/1498f39484cbf5583724/) SK Hynix · San Jose, CA ### [Staff Engineer, HBM Field Application](https://jobs.opennash.com/companies/sk-hynix/jobs/59b7a71405de9a702434/) SK Hynix · San Jose, CA ### [Silicon Validation Engineer, HBM, Google Cloud](https://jobs.opennash.com/companies/alphabet/jobs/39da05f6974afebf19ab/) Alphabet · Sunnyvale, CA, USA [Operations jobs](/functions/operations/) OpenNash lists jobs from employers’ own careers sites and does not handle applications. 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