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MediaTek · HsinChu

# <Data center>Design Engineer - Die-to-Die Interface

HsinChu Data & Analytics 

Listed on MediaTek’s official careers site. Listed as of October 23, 2026. Check that it is still open and apply there.
[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120260921006)

[OpenNash Jobs](https://jobs.opennash.com/) / [MediaTek](https://jobs.opennash.com/companies/mediatek/) / <Data center>Design Engineer - Die-to-Die Interface

## Job description

Join our next-generation HPC SoC team to build cutting-edge Chiplet interconnect solutions. Whether you are an experienced architect or a recent graduate with strong fundamentals, this role offers a clear path to becoming a specialist in UCIe, D2D, and Advanced Packaging technologies. We value potential and provide the mentorship needed to grow into the role.
- Develop Die-to-die and UCIe digital IP for HPC SOC. Design and implement robust digital IP blocks that enable high-bandwidth, low-latency communication across chiplets in complex HPC systems.
- Integration of D2D controller and PHY to timing closure and DFT. Drive the integration flow between controllers and PHY layers, ensuring timing closure sign-off and implementing design-for-test strategies for manufacturing quality.
- Define interface specifications, creating comprehensive verification plans, and support integration and physical implementation. Own the interface definition lifecycle, develop rigorous verification plans, and collaborate on physical implementation.
- Work closely with multiple teams such as mixed mode designers and Firmware engineers. Partner across disciplines to align on system-level goals, debug complex integration issues, and ensure seamless firmware-hardware co-design. #LI-LYNN

## At a glance
- Posted by the employer: Not stated
- First seen by OpenNash: Oct 23, 2026
- Last checked: Oct 23, 2026
- Listed for: Under a day
- Location: HsinChu[Apply on MediaTek’s careers site →](https://careers.mediatek.com/en/jobs/MTK120260921006)

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